SCHEMBL2927746

SCHEMBL2927746

COC(COCOCCN)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1507473 0.88
SCHEMBL29101470 0.84
SCHEMBL18217367 0.74
SCHEMBL8994245 0.74
SCHEMBL23616086 0.71
SCHEMBL14249132 0.71 ALDH1A1 (0.31)
SCHEMBL8526598 0.71 ODC1 (0.30)
SCHEMBL2788411 0.70 CA2 (0.34)
SCHEMBL14273905 0.70
SCHEMBL2417794 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 122 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114163564-B Film-forming resin containing cholic acid-butenoate derivative and photoresist composition 江苏集萃光敏电子材料研究所有限公司 2023-02-28 CN claimed
CN-114163564-A Film-forming resin containing cholic acid-butenoate derivative and photoresist composition 江苏集萃光敏电子材料研究所有限公司 2022-03-11 CN claimed
CN-113999340-A Film-forming resin containing silicon or sulfur and photoresist composition 江苏集萃光敏电子材料研究所有限公司 2022-02-01 CN claimed
CN-111123649-A Negative photoresist composition containing high-heat-resistance carboxyl phenolic resin 苏州瑞红电子化学品有限公司 2020-05-08 CN claimed
CN-115974880-A Crosslinking agent, preparation method thereof and photoresist 上海彤程电子材料有限公司 2023-04-18 CN disclosed
CN-115947648-A Crosslinking agent, preparation method thereof and photoresist 北京彤程创展科技有限公司 2023-04-11 CN disclosed
CN-115925645-A Crosslinking agent, preparation method thereof and photoresist 上海彤程电子材料有限公司 2023-04-07 CN disclosed
CN-114163564-B Film-forming resin containing cholic acid-butenoate derivative and photoresist composition 江苏集萃光敏电子材料研究所有限公司 2023-02-28 CN disclosed
CN-114163564-A Film-forming resin containing cholic acid-butenoate derivative and photoresist composition 江苏集萃光敏电子材料研究所有限公司 2022-03-11 CN disclosed
CN-113999340-A Film-forming resin containing silicon or sulfur and photoresist composition 江苏集萃光敏电子材料研究所有限公司 2022-02-01 CN disclosed
CN-113717314-A Photosensitive film-forming resin, photoresist composition and preparation method thereof 江苏集萃光敏电子材料研究所有限公司 2021-11-30 CN disclosed
CN-111123649-A Negative photoresist composition containing high-heat-resistance carboxyl phenolic resin 苏州瑞红电子化学品有限公司 2020-05-08 CN disclosed
EP-1096318-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-05-02 EP disclosed
EP-1096317-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-05-02 EP disclosed
EP-1085377-A1 Resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-03-21 EP disclosed
EP-1053985-A1 Resist compositions and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2000-11-22 EP disclosed
EP-1053986-A1 Resist materials and compounds therefore SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-11-22 EP disclosed
US-6147249-A ESTER COMPOUND CAPABLE OF FORMING ACID-DECOMPOSABLE POLYMER WHICH CAN BE BLENDED AS BASE RESIN TO FORMULATE RESIST COMPOSITION HAVING HIGHER SENSITIVITY, RESOLUTION AND ETCHING RESISTANCE THAN CONVENTIONAL RESIST COMPOSITIONS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-11-14 US disclosed
EP-1031879-A1 Novel ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-08-30 EP disclosed
EP-1004568-A2 Novel ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-05-31 EP disclosed