Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSP90AA1 | P07900 | 4/20 | 0.80 |
| ▸ | MGLL | Q99685 | 18/20 | 0.64 |
| ▸ | FAAH | O00519 | 9/20 | 0.64 |
| ▸ | PKM | P14618 | 2/20 | 0.52 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.52 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.52 |
| ▸ | G6PD | P11413 | 1/20 | 0.48 |
| ▸ | TLR9 | Q9NR96 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.48 |
| ▸ | HTT | P42858 | 1/20 | 0.48 |
| ▸ | ATM | Q13315 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19512050 | 0.93 | HSP90AA1 (0.83) | HSP90AA1MGLLFAAHPKMMAPK1 | |
| SCHEMBL29510752 | 0.89 | HSP90AA1 (1.00) | HSP90AA1MGLLFAAHPKMALDH1A1 | |
| SCHEMBL2146237 | 0.89 | HSP90AA1 (1.00) | HSP90AA1MGLLFAAHPKMALDH1A1 | |
| SCHEMBL10411648 | 0.87 | HSP90AA1 (0.89) | HSP90AA1MGLLFAAHPKMMAPK1 | |
| SCHEMBL719070 | 0.87 | HSP90AA1 (0.89) | HSP90AA1MGLLFAAHPKMMAPK1 | |
| SCHEMBL723972 | 0.87 | HSP90AA1 (0.89) | HSP90AA1MGLLFAAHPKMMAPK1 | |
| SCHEMBL95324 | 0.79 | MGLL (1.00) | HSP90AA1MGLLFAAHPKMMAPK1 | |
| SCHEMBL8366339 | 0.78 | MGLL (0.66) | HSP90AA1MGLLFAAHPKMMAPK1 | |
| SCHEMBL1838889 | 0.75 | MGLL (1.00) | HSP90AA1MGLLFAAHPKMALDH1A1 | |
| SCHEMBL94730 | 0.75 | MGLL (1.00) | HSP90AA1MGLLFAAHPKMALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118772377-A | Urea epoxy curing accelerator, epoxy conductive silver adhesive and preparation method | 汉方新材料科技(嘉善)有限公司 | 2024-10-15 | — | — | CN | disclosed |
| US-20240191014-A1 | ETHYLENE-(METH)ACRYLATE-BASED ELASTOMER AND METHOD FOR PRODUCING THE SAME | UNIMATEC CO., LTD. (JP) | 2024-06-13 | — | — | US | disclosed |
| US-20240158548-A1 | ETHYLENE-(METH)ACRYLATE-BASED ELASTOMER AND METHOD FOR PRODUCING THE SAME | UNIMATEC CO., LTD. (JP) | 2024-05-16 | — | — | US | disclosed |
| EP-4310111-A1 | ETHYLENE/(METH)ACRYLATE-BASED ELASTOMER AND PRODUCTION METHOD THEREFOR | Unimatec Co., Ltd. (JP) | 2024-01-24 | — | — | EP | disclosed |
| EP-4310109-A1 | ETHYLENE-(METH)ACRYLATE ELASTOMER AND MANUFACTURING METHOD THEREFOR | Unimatec Co., Ltd. (JP) | 2024-01-24 | — | — | EP | disclosed |
| US-20220112373-A1 | THERMOSETTING RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2022-04-14 | — | — | US | disclosed |
| CN-109689742-B | Curable resin mixture and method for producing curable resin composition | 昭和电工株式会社 | 2021-12-10 | — | — | CN | disclosed |
| US-20210284783-A1 | METHODS FOR PRODUCING CURABLE RESIN MIXTURE AND CURABLE RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2021-09-16 | — | — | US | disclosed |
| CN-113316597-A | Thermosetting resin composition | 昭和电工株式会社 | 2021-08-27 | — | — | CN | disclosed |
| US-10689493-B2 | Thermosetting resin composition | SHOWA DENKO K.K. (JP) | 2020-06-23 | — | — | US | disclosed |
| CN-109689742-A | The manufacturing method of curable resin mixture and hardening resin composition | 昭和电工株式会社 | 2019-04-26 | — | — | CN | disclosed |
| US-10160856-B2 | Thermosetting resin composition | SHOWA DENKO K.K. (JP) | 2018-12-25 | — | — | US | disclosed |
| US-20180282494-A1 | THERMOSETTING RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2018-10-04 | — | — | US | disclosed |
| US-20170349743-A1 | THERMOSETTING RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2017-12-07 | — | — | US | disclosed |
| EP-3239200-A1 | THERMOSETTING RESIN COMPOSITION | Showa Denko K.K. (JP) | 2017-11-01 | — | — | EP | disclosed |
| EP-3239199-A1 | THERMOSETTING RESIN COMPOSITION | Showa Denko K.K. (JP) | 2017-11-01 | — | — | EP | disclosed |
| EP-1550694-B1 | ACRYLIC RUBBER COMPOSITION AND CROSSLINKED OBJECT | ZEON CORP (JP) | 2010-09-08 | — | — | EP | disclosed |
| US-7459495-B2 | Acrylic rubber composition and crosslinked object | ZEON CORPORATION (JP) | 2008-12-02 | — | — | US | disclosed |
| US-20060167159-A1 | Acrylic rubber composition and crosslinked object | ZEON CORPORATION (JP) | 2006-07-27 | — | — | US | disclosed |
| EP-1550694-A1 | ACRYLIC RUBBER COMPOSITION AND CROSSLINKED OBJECT | Zeon Corporation (JP) | 2005-07-06 | — | — | EP | disclosed |