SCHEMBL8366339

SCHEMBL8366339

O=C1C=CC(=O)N1c1ccc(Oc2ccc3ccc(Oc4ccc(N5C(=O)C=CC5=O)cc4)cc3c2)cc1

nearest known ligand 0.66

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 16/20 0.66
HSP90AA1 P07900 3/20 0.58
FAAH O00519 6/20 0.54
PKM P14618 2/20 0.50
MEN1 O00255 1/20 0.50
ALDH1A1 P00352 1/20 0.50
LMNA P02545 1/20 0.50
HPGD P15428 1/20 0.50
HTT P42858 1/20 0.50
CCR6 P51684 1/20 0.50
KMT2A Q03164 1/20 0.50
ATM Q13315 1/20 0.50
MAPK1 P28482 1/20 0.46
NPSR1 Q6W5P4 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
MAOA P21397 1/20 0.42
MAOB P27338 1/20 0.42
DDAH1 O94760 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL331752 0.87 MGLL (0.84) MGLLHSP90AA1FAAHPKMMEN1
SCHEMBL487033 0.87 MGLL (0.84) MGLLHSP90AA1FAAHPKMMEN1
SCHEMBL4385482 0.87 MGLL (0.84) MGLLHSP90AA1FAAHPKMMEN1
SCHEMBL486855 0.84 MGLL (0.79) MGLLHSP90AA1FAAHPKMMEN1
SCHEMBL2120468 0.82 MGLL (0.77) MGLLHSP90AA1FAAHPKMMEN1
SCHEMBL9245833 0.81 MGLL (0.75) MGLLHSP90AA1FAAHPKMMEN1
SCHEMBL24119952 0.81 MGLL (0.74) MGLLHSP90AA1FAAHPKMMEN1
SCHEMBL3675014 0.79 MGLL (1.00) MGLLHSP90AA1FAAHPKMMEN1
SCHEMBL2928275 0.78 HSP90AA1 (0.80) MGLLHSP90AA1FAAHPKMALDH1A1
SCHEMBL5068628 0.78 MGLL (0.77) MGLLHSP90AA1FAAHPKMMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024181344-A1 MODIFIED OLEFIN COPOLYMER, RESIN COMPOSITION, LAMINATED SHEET, PREPREG, CURED PRODUCT, SUBSTRATE PROVIDED WITH CURED PRODUCT, AND ELECTRONIC DEVICE artience株式会社 2024-09-06 WO disclosed
WO-2023127523-A1 RESIN COMPOSITION, MULTILAYER SHEET, PREPREG, CURED PRODUCT, SUBSTRATE WITH CURED PRODUCT, AND ELECTRONIC DEVICE 東洋インキSCホールディングス株式会社 2023-07-06 WO disclosed
WO-2023112443-A1 HEAT-CURABLE COMPOSITION, ADHESIVE SHEET, PRINTED WIRING BOARD, AND ELECTRONIC APPLIANCE 東洋インキSCホールディングス株式会社 2023-06-22 WO disclosed
US-5886134-A FROM ARYLENE DICYANATES AND ARYLENEDIOXYDIPHENYLENEBISMALEIMIDES NATIONAL SCIENCE COUNCIL OF REPUBLIC OF CHINA (TW) 1999-03-23 US disclosed