Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 1/20 | 0.37 |
| ▸ | HTT | P42858 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 2/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 4/20 | 0.33 |
| ▸ | TP53 | P04637 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | CTSD | P07339 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.31 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.31 |
| ▸ | KDM5C | P41229 | 1/20 | 0.30 |
| ▸ | PHF8 | Q9UPP1 | 1/20 | 0.30 |
| ▸ | KDM2A | Q9Y2K7 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL28241761 | 0.99 | POLB (0.36) | POLBHTTMAPTKDM4ETP53 | |
| SCHEMBL13933033 | 0.91 | POLB (0.32) | POLBHTT | |
| SCHEMBL23081582 | 0.83 | RAB9A (0.34) | KDM4ETP53HSD17B10HDAC1HDAC6 | |
| SCHEMBL4413710 | 0.81 | POLB (0.43) | POLBHTTMAPTKDM4ECTSD | |
| SCHEMBL5708465 | 0.75 | POLB (0.38) | POLBHTTMAPTKDM4ETP53 | |
| SCHEMBL17803977 | 0.75 | POLB (0.41) | POLBHTTMAPTKDM4ECTSD | |
| SCHEMBL11056809 | 0.73 | KDM4E (0.33) | KDM4ETP53HSD17B10LMNAHDAC1 | |
| SCHEMBL4416869 | 0.71 | KMT2A (0.42) | POLBMAPTKDM4ELMNAHDAC1 | |
| SCHEMBL11636451 | 0.69 | TSHR (0.37) | MAPTKDM4ETP53HSD17B10HDAC1 | |
| SCHEMBL21393237 | 0.67 | F2 (0.37) | TP53HDAC6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 210 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4735503-A1 | HEAT-CURABLE SEALING COMPOSITION | Sika Technology AG (CH) | 2026-05-06 | — | — | EP | claimed |
| EP-4727989-A1 | HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR LOW CURING TEMPERATURE WITH GOOD STORAGE STABILITY | Sika Technology AG (CH) | 2026-04-22 | — | — | EP | claimed |
| EP-4585632-A1 | HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR LOW CURING TEMPERATURE WITH GOOD ADHESION AND TOUGHENING ABILITIES | Sika Technology AG (CH) | 2025-07-16 | — | — | EP | claimed |
| WO-2025073846-A1 | HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR LOW CURING TEMPERATURE WITH GOOD OPEN TIME AND CORROSION RESISTANCE | SIKA TECHNOLOGY AG (CH) | 2025-04-10 | — | — | WO | claimed |
| EP-4534580-A1 | HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR LOW CURING TEMPERATURE WITH GOOD OPEN TIME AND CORROSION RESISTANCE | Sika Technology AG (CH) | 2025-04-09 | — | — | EP | claimed |
| US-20250084235-A1 | Low Emission Polyoxymethylene Composition | CELANESE INTERNATIONAL CORPORATION | 2025-03-13 | — | — | US | claimed |
| EP-4314106-B1 | THERMOSETTING EPOXY RESIN COMPOSITION SUITABLE FOR PRECURING WITHOUT ADDITIONAL METAL BONDING TECHNIQUES | SIKA TECH AG (CH) | 2025-02-19 | — | — | EP | claimed |
| EP-4497768-A1 | HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR LOW CURING TEMPERATURE WITH GOOD STORAGE STABILITY | Sika Technology AG (CH) | 2025-01-29 | — | — | EP | claimed |
| EP-4484461-A1 | HEAT-CURABLE SEALING COMPOSITION | Sika Technology AG (CH) | 2025-01-01 | — | — | EP | claimed |
| EP-4477685-A1 | HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR LOW CURING TEMPERATURE WITH GOOD STORAGE STABILITY | Sika Technology AG (CH) | 2024-12-18 | — | — | EP | claimed |
| CN-112143164-B | Polyacetal resin composition and method for producing same | 宝理塑料株式会社 | 2023-08-29 | — | — | CN | claimed |
| US-11661511-B2 | Production method of polyacetal resin composition | POLYPLASTICS CO., LTD. (JP) | 2023-05-30 | — | — | US | claimed |
| WO-2022207411-A2 | HEAT-CURING EPOXY RESIN COMPOSITION SUITABLE FOR PRE-CURING PROCESSES WITHOUT ADDITIONAL METAL JOINING TECHNIQUES | SIKA TECHNOLOGY AG (CH) | 2022-10-06 | — | — | WO | claimed |
| EP-4067405-A1 | THERMOSETTING EPOXY RESIN COMPOSITION SUITABLE FOR PRECURING WITHOUT ADDITIONAL METAL BONDING TECHNIQUES | Sika Technology AG (CH) | 2022-10-05 | — | — | EP | claimed |
| CN-114685933-A | Polyformaldehyde composite material and preparation method and application thereof | 江苏金发科技新材料有限公司 | 2022-07-01 | — | — | CN | claimed |
| CN-113677724-B | Polyacetal resin composition and method for producing same | 宝理塑料株式会社 | 2022-06-28 | — | — | CN | claimed |
| EP-3512906-B1 | CATALYST-DOPED SIZING AGENT FOR PREPARATION OF HIGH AREAL WEIGHT FIBER SHELF-STABLE PREPREG OR MOLDING COMPOUND INTERMEDIATES | DOW GLOBAL TECHNOLOGIES LLC (US) | 2020-09-23 | — | — | EP | claimed |
| US-20170171971-A1 | POLYIMIDE, POLYIMIDE FILM, AND FLEXIBLE COPPER-COATED LAMINATE | TAIFLEX SCIENTIFIC CO., LTD. (TW) | 2017-06-15 | — | — | US | claimed |
| US-8507053-B2 | Sealant and liquid crystal display using the same | SAMSUNG DISPLAY CO., LTD. (KR) | 2013-08-13 | — | — | US | claimed |
| US-20080079891-A1 | Sealant and liquid crystal display using the same | SAMSUNG ELECTRONICS CO., LTD. | 2008-04-03 | — | — | US | claimed |