SCHEMBL29353079

SCHEMBL29353079

O=C1C=CC(=O)N1c1cccc(Oc2cccc(Oc3cccc(Oc4cccc(Oc5cccc(N6C(=O)C=CC6=O)c5)c4)c3)c2)c1

nearest known ligand 0.70

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 14/20 0.70
FAAH O00519 6/20 0.69
HSP90AA1 P07900 3/20 0.58
ALDH1A1 P00352 1/20 0.56
PKM P14618 1/20 0.56
HTT P42858 1/20 0.56
ATM Q13315 1/20 0.56
HPN P05981 1/20 0.51
BRD4 O60885 1/20 0.44
G6PD P11413 1/20 0.43
TLR9 Q9NR96 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4459418 1.00 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL4459406 1.00 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29352936 1.00 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL331661 1.00 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL1271670 1.00 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL30104191 1.00 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL332317 1.00 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL2120164 0.98 MGLL (0.72) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL27863634 0.94 MGLL (0.71) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL27863609 0.94 MGLL (0.71) MGLLFAAHHSP90AA1ALDH1A1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114479459-B Resin composition, laminate, and multilayer printed wiring board 株式会社力森诺科 2025-03-21 CN disclosed
CN-113717526-B Resin composition, support with resin layer, prepreg, and laminate 株式会社力森诺科 2024-06-11 CN disclosed
CN-113337117-B Resin composition, support, prepreg, laminate, multilayer printed wiring board, and printed wiring board for millimeter wave radar 株式会社力森诺科 2023-07-14 CN disclosed
CN-114479459-A Resin composition, laminate, and multilayer printed wiring board 昭和电工材料株式会社 2022-05-13 CN disclosed
CN-109476923-B Resin composition, laminate, and multilayer printed wiring board 昭和电工材料株式会社 2022-04-05 CN disclosed
CN-108464060-B Multilayer transmission circuit board 昭和电工材料株式会社 2022-01-25 CN disclosed