SCHEMBL2120164

SCHEMBL2120164

O=C1C=CC(=O)N1c1cccc(Oc2cccc(N3C(=O)C=CC3=O)c2)c1

nearest known ligand 0.72

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 14/20 0.72
FAAH O00519 6/20 0.72
HSP90AA1 P07900 4/20 0.60
ALDH1A1 P00352 2/20 0.58
PKM P14618 2/20 0.58
HTT P42858 2/20 0.58
ATM Q13315 2/20 0.58
HPN P05981 1/20 0.53
G6PD P11413 1/20 0.44
TLR9 Q9NR96 1/20 0.44
MEN1 O00255 1/20 0.43
LMNA P02545 1/20 0.43
HPGD P15428 1/20 0.43
CCR6 P51684 1/20 0.43
KMT2A Q03164 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4459418 0.98 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29353079 0.98 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL331661 0.98 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29352936 0.98 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL30104191 0.98 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL332317 0.98 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL1271670 0.98 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL4459406 0.98 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL9491223 0.96 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL487151 0.96 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109689742-B Curable resin mixture and method for producing curable resin composition 昭和电工株式会社 2021-12-10 CN disclosed
US-20210284783-A1 METHODS FOR PRODUCING CURABLE RESIN MIXTURE AND CURABLE RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2021-09-16 US disclosed
CN-113316597-A Thermosetting resin composition 昭和电工株式会社 2021-08-27 CN disclosed
US-10689493-B2 Thermosetting resin composition SHOWA DENKO K.K. (JP) 2020-06-23 US disclosed
WO-2020070531-A1 CURABLE RESIN COMPOSITION, CURED OBJECT THEREFROM, METHOD FOR PRODUCING STRUCTURE USING SAID CURABLE RESIN COMPOSITION, AND STRUCTURE INCLUDING SAID CURED OBJECT 昭和電工株式会社 2020-04-09 WO disclosed
EP-3613781-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF Showa Denko K.K. (JP) 2020-02-26 EP disclosed
EP-3613780-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF Showa Denko K.K. (JP) 2020-02-26 EP disclosed
US-20200031966-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2020-01-30 US disclosed
US-20200031973-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2020-01-30 US disclosed
EP-3239199-B1 THERMOSETTING RESIN COMPOSITION SHOWA DENKO KK (JP) 2019-09-25 EP disclosed
EP-3239199-A1 THERMOSETTING RESIN COMPOSITION Showa Denko K.K. (JP) 2017-11-01 EP disclosed
CN-107108821-A Thermosetting resin composition 昭和电工株式会社 2017-08-29 CN disclosed
CN-107001547-A Thermosetting resin composition 昭和电工株式会社 2017-08-01 CN disclosed
US-8871894-B2 Production method of polyhydroxyimide NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-10-28 US disclosed
US-8796393-B2 Production method of polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-08-05 US disclosed
US-20130131282-A1 PRODUCTION METHOD OF POLYHYDROXYIMIDE AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION CONTAINING POLYHYDROXYIMIDE OBTAINED BY THE PRODUCTION METHOD NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-05-23 US disclosed
US-20120094232-A1 PRODUCTION METHOD OF POLYHYDROXYIMIDE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-04-19 US disclosed
US-20100304291-A1 PRODUCTION METHOD OF POLYHYDROXYIMIDE AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION CONTAINING POLYHYDROXYIMIDE OBTAINED BY THE PRODUCTION METHOD NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-12-02 US disclosed
EP-0515170-A2 Biscyclobutarene/polymaleimide copolymers THE DOW CHEMICAL COMPANY (US) 1992-11-25 EP disclosed
US-4607093-A Sydnone based polyimide THE DOW CHEMICAL COMPANY (US) 1986-08-19 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120094232-A1 PRODUCTION METHOD OF POLYHYDROXYIMIDE GRHPR, MRPL21, F12 MGLL 2201/4885FAAH 1572/4885HSP90AA1 622/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.