SCHEMBL2936745

SCHEMBL2936745

CCC(CCCCCCC(=O)O)C(CC)CCCCCCC(=O)O

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.62
FFAR4 Q5NUL3 2/20 0.59
FFAR1 O14842 2/20 0.59
GPR84 Q9NQS5 7/20 0.56
PPARG P37231 7/20 0.56
PPARD Q03181 7/20 0.56
PPARA Q07869 7/20 0.56
HDAC11 Q96DB2 5/20 0.56
TSHR P16473 5/20 0.56
PTPN1 P18031 3/20 0.56
TLR2 O60603 2/20 0.56
TDP1 Q9NUW8 2/20 0.56
FABP4 P15090 2/20 0.56
SLC22A6 Q4U2R8 1/20 0.56
SLC22A8 Q8TCC7 1/20 0.56
MEN1 O00255 1/20 0.56
ESR1 P03372 1/20 0.56
ALOX15 P16050 1/20 0.56
PDE4A P27815 1/20 0.56
KMT2A Q03164 1/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5879118 0.94 FFAR4 (0.69) ALDH1A1FFAR4FFAR1GPR84PPARG
SCHEMBL7034531 0.94 ALDH1A1 (0.67) ALDH1A1FFAR4FFAR1GPR84PPARG
SCHEMBL14359961 0.93 ALDH1A1 (0.55) ALDH1A1FFAR4FFAR1GPR84PPARG
SCHEMBL14360303 0.92 ALDH1A1 (0.55) ALDH1A1FFAR4FFAR1GPR84PPARG
SCHEMBL14360113 0.91 ALDH1A1 (0.50) ALDH1A1FFAR4FFAR1GPR84PPARG
SCHEMBL18533503 0.90 ALDH1A1 (0.63) ALDH1A1FFAR4FFAR1GPR84PPARG
SCHEMBL14360256 0.90 ALDH1A1 (0.52) ALDH1A1FFAR4FFAR1GPR84PPARG
SCHEMBL5878794 0.89 ALDH1A1 (0.61) ALDH1A1FFAR4FFAR1GPR84PPARG
SCHEMBL5878638 0.87 FFAR4 (0.61) ALDH1A1FFAR4FFAR1GPR84PPARG
SCHEMBL365928 0.87 FFAR4 (0.61) ALDH1A1FFAR4FFAR1GPR84PPARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111819242-B Epoxy resin composition, cured product thereof, and semiconductor device 日铁化学材料株式会社 2023-09-26 CN disclosed
CN-111819242-A Epoxy resin composition and cured product thereof 日铁化学材料株式会社 2020-10-23 CN disclosed
WO-2019171993-A1 EPOXY RESIN COMPOSITION AND CURED PRODUCT OF SAME 日鉄ケミカル&マテリアル株式会社 2019-09-12 WO disclosed
US-7858173-B2 Thermoplastic polyhydroxy polyether resin and resin composition comprising the same NIPPON STEEL CHEMICALS CO., LTD. (JP) 2010-12-28 US disclosed
US-20100119805-A1 NOVEL THERMOPLASTIC POLYHYDROXY POLYETHER RESIN AND RESIN COMPOSITION COMPRISING THE SAME TOHTO KASEI CO., LTD. (JP) 2010-05-13 US disclosed