Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 1.00 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 1.00 |
| ▸ | POLB | P06746 | 2/20 | 1.00 |
| ▸ | MAPK1 | P28482 | 2/20 | 1.00 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 1.00 |
| ▸ | HPGD | P15428 | 1/20 | 1.00 |
| ▸ | TSHR | P16473 | 1/20 | 1.00 |
| ▸ | CYP1A2 | P05177 | 4/20 | 0.71 |
| ▸ | CYP2D6 | P10635 | 3/20 | 0.71 |
| ▸ | ALOX5 | P09917 | 3/20 | 0.69 |
| ▸ | RECQL | P46063 | 2/20 | 0.66 |
| ▸ | APEX1 | P27695 | 1/20 | 0.66 |
| ▸ | CYP2C19 | P33261 | 3/20 | 0.63 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.63 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.63 |
| ▸ | STAT6 | P42226 | 1/20 | 0.63 |
| ▸ | MAPT | P10636 | 3/20 | 0.62 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.61 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.61 |
| ▸ | NPC1 | O15118 | 2/20 | 0.60 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL144880 | 1.00 | SMN1; SMN2 (1.00) | SMN1; SMN2ALDH1A1POLBMAPK1HSD17B10 | |
| SCHEMBL29229036 | 0.98 | SMN1; SMN2 (0.97) | SMN1; SMN2ALDH1A1POLBMAPK1HSD17B10 | |
| SCHEMBL6274961 | 0.92 | SMN1; SMN2 (0.85) | SMN1; SMN2ALDH1A1POLBMAPK1HSD17B10 | |
| SCHEMBL3497943 | 0.91 | SMN1; SMN2 (0.84) | SMN1; SMN2ALDH1A1POLBMAPK1HSD17B10 | |
| SCHEMBL10535954 | 0.90 | SMN1; SMN2 (0.82) | SMN1; SMN2ALDH1A1POLBMAPK1HSD17B10 | |
| SCHEMBL14155879 | 0.89 | SMN1; SMN2 (0.80) | SMN1; SMN2ALDH1A1POLBMAPK1HSD17B10 | |
| SCHEMBL13164429 | 0.89 | SMN1; SMN2 (0.80) | SMN1; SMN2ALDH1A1POLBMAPK1HSD17B10 | |
| Choline SCHEMBL29148516 | 0.87 | SMN1; SMN2 (0.75) | SMN1; SMN2ALDH1A1POLBMAPK1HSD17B10 | |
| SCHEMBL8984918 | 0.87 | POLB (0.76) | SMN1; SMN2ALDH1A1POLBMAPK1HSD17B10 | |
| SCHEMBL13629729 | 0.87 | SMN1; SMN2 (0.76) | SMN1; SMN2ALDH1A1POLBMAPK1HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117043301-A | Solid coolant concentrate and preparation thereof | 巴斯夫欧洲公司 | 2023-11-10 | — | — | CN | claimed |
| CN-119585073-A | Soldering flux and soldering paste | 千住金属工业株式会社 | 2025-03-07 | — | — | CN | disclosed |
| CN-115997257-B | Silver nanowire dispersion, silver nanowire-containing conductor, and silver nanowire-containing conductive laminate | 星光PMC株式会社 | 2024-10-15 | — | — | CN | disclosed |
| CN-118574898-A | Resin composition and resin film | 日本瑞翁株式会社 | 2024-08-30 | — | — | CN | disclosed |
| CN-112481691-B | Electrolytic cleaning agent and method for cleaning metal | 日华化学（中国）有限公司 | 2024-06-25 | — | — | CN | disclosed |
| CN-117062894-A | Coolant with improved temperature stability | 巴斯夫欧洲公司 | 2023-11-14 | — | — | CN | disclosed |
| CN-117043301-A | Solid coolant concentrate and preparation thereof | 巴斯夫欧洲公司 | 2023-11-10 | — | — | CN | disclosed |
| WO-2023181953-A1 | RESIN COMPOSITION AND RESIN FILM | 日本ゼオン株式会社 | 2023-09-28 | — | — | WO | disclosed |
| CN-116330148-A | Substrate polishing method and method for removing metal layer of substrate | 株式会社荏原制作所 | 2023-06-27 | — | — | CN | disclosed |
| CN-110036341-B | Photosensitive resin composition, photosensitive resin laminate, method for producing resin pattern, and method for producing cured film pattern | 旭化成株式会社 | 2023-06-09 | — | — | CN | disclosed |
| CN-110663103-B | Substrate polishing method | 株式会社荏原制作所 | 2023-06-06 | — | — | CN | disclosed |
| CN-115997257-A | Silver nanowire dispersion, silver nanowire-containing conductor, and silver nanowire-containing conductive laminate | 星光PMC株式会社 | 2023-04-21 | — | — | CN | disclosed |
| CN-115605553-A | Aqueous anticorrosive coating composition | 日涂工业涂料有限公司（JP） | 2023-01-13 | — | — | CN | disclosed |
| CN-115335925-A | Conductive film, touch panel, photosensitive resin composition, and method for producing conductive film | 富士胶片株式会社 | 2022-11-11 | — | — | CN | disclosed |
| CN-107870514-B | Photosensitive resin composition | 株式会社田村制作所 | 2022-09-16 | — | — | CN | disclosed |
| CN-111032789-B | Adhesive composition, anchor body, and method for producing anchor body | 株式会社日本触媒 | 2022-09-13 | — | — | CN | disclosed |
| CN-114609864-A | Photosensitive resin composition | 旭化成株式会社 | 2022-06-10 | — | — | CN | disclosed |
| CN-114556276-A | Touch sensor component precursor and method for manufacturing touch sensor component | 富士胶片株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-106661734-B | Method for manufacturing circuit board and circuit board manufactured by the same | 上村工业株式会社 | 2022-02-25 | — | — | CN | disclosed |
| CN-114000129-A | Electroless palladium plating bath | 上村工业株式会社 | 2022-02-01 | — | — | CN | disclosed |