Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC1 | Q13547 | 1/20 | 0.58 |
| ▸ | CA12 | O43570 | 5/20 | 0.55 |
| ▸ | CA1 | P00915 | 5/20 | 0.55 |
| ▸ | CA2 | P00918 | 5/20 | 0.55 |
| ▸ | CA7 | P43166 | 5/20 | 0.55 |
| ▸ | CA9 | Q16790 | 5/20 | 0.55 |
| ▸ | CA14 | Q9ULX7 | 5/20 | 0.55 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.55 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.55 |
| ▸ | SELL | P14151 | 1/20 | 0.52 |
| ▸ | SELP | P16109 | 1/20 | 0.52 |
| ▸ | SIRT1 | Q96EB6 | 2/20 | 0.51 |
| ▸ | HPGD | P15428 | 2/20 | 0.48 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.48 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.48 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.48 |
| ▸ | CASP1 | P29466 | 1/20 | 0.48 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.48 |
| ▸ | CES2 | O00748 | 1/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL759926 | 1.00 | HDAC1 (0.58) | HDAC1CA12CA1CA2CA7 | |
| SCHEMBL8861157 | 0.89 | CA12 (0.52) | HDAC1CA12CA1CA2CA7 | |
| SCHEMBL29071839 | 0.89 | CA1 (0.68) | HDAC1CA12CA1CA2CA7 | |
| SCHEMBL1397329 | 0.88 | HDAC1 (0.58) | HDAC1CA12CA1CA2CA7 | |
| SCHEMBL93552 | 0.88 | HDAC1 (0.58) | HDAC1CA12CA1CA2CA7 | |
| SCHEMBL29450717 | 0.88 | HDAC1 (0.58) | HDAC1CA12CA1CA2CA7 | |
| SCHEMBL3905124 | 0.87 | CA12 (0.70) | CA12CA1CA2CA7CA9 | |
| SCHEMBL27789123 | 0.86 | HDAC1 (0.56) | HDAC1CA12CA1CA2CA7 | |
| SCHEMBL9639957 | 0.86 | CA12 (0.53) | HDAC1CA12CA1CA2CA7 | |
| SCHEMBL1063407 | 0.85 | SELL (0.68) | HDAC1SELLSELPHPGDALOX15 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4702010-A1 | PHOTOACTIVE COMPOUNDS | Merck Patent GmbH (DE) | 2026-03-04 | — | — | EP | disclosed |
| CN-120077104-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-05-30 | — | — | CN | disclosed |
| CN-119998728-A | Film manufacturing method, photosensitive resin composition, cured product manufacturing method, cured product, and laminate | 富士胶片株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119968421-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-05-09 | — | — | CN | disclosed |
| CN-119731595-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-03-28 | — | — | CN | disclosed |
| CN-119731225-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-03-28 | — | — | CN | disclosed |
| WO-2024223739-A1 | PHOTOACTIVE COMPOUNDS | MERCK PATENT GMBH (DE) | 2024-10-31 | — | — | WO | disclosed |
| CN-111324013-B | Chemically amplified positive photosensitive resin composition and application thereof | 奇美实业股份有限公司 | 2023-12-01 | — | — | CN | disclosed |
| CN-117099045-A | Negative photosensitive resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-11-21 | — | — | CN | disclosed |
| CN-111381438-B | Chemically amplified positive photosensitive resin composition and application thereof | 奇美实业股份有限公司 | 2023-06-20 | — | — | CN | disclosed |
| CN-109062007-B | Positive photosensitive polysiloxane composition and application thereof | 奇美实业股份有限公司 | 2023-03-10 | — | — | CN | disclosed |
| CN-115437214-A | Chemically amplified positive photosensitive resin composition, protective film, and element having protective film | 奇美实业股份有限公司 | 2022-12-06 | — | — | CN | disclosed |
| CN-108693710-B | Positive photosensitive polysiloxane composition | 奇美实业股份有限公司 | 2022-12-02 | — | — | CN | disclosed |
| CN-107870516-B | Positive photosensitive resin composition, patterned film and method for manufacturing bump | 奇美实业股份有限公司 | 2022-08-02 | — | — | CN | disclosed |
| CN-107179652-B | Positive photosensitive polysiloxane composition and application thereof | 奇美实业股份有限公司 | 2022-02-08 | — | — | CN | disclosed |