SCHEMBL93552

SCHEMBL93552

O=C(c1ccc(O)cc1O)c1ccc(O)c(O)c1O

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 1/20 0.58
CES2 O00748 1/20 0.57
MEN1 O00255 2/20 0.56
KMT2A Q03164 2/20 0.56
GAA P10253 2/20 0.56
USP2 O75604 1/20 0.56
KEAP1 Q14145 1/20 0.56
NFE2L2 Q16236 1/20 0.56
ALDH1A1 P00352 3/20 0.55
CA12 O43570 3/20 0.55
CA1 P00915 3/20 0.55
CA2 P00918 3/20 0.55
CA7 P43166 3/20 0.55
CA9 Q16790 3/20 0.55
CA14 Q9ULX7 3/20 0.55
TSHR P16473 1/20 0.55
SELL P14151 1/20 0.52
SELP P16109 1/20 0.52
ESR1 P03372 1/20 0.50
SHBG P04278 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29450717 1.00 HDAC1 (0.58) HDAC1CES2MEN1KMT2AGAA
SCHEMBL1397329 1.00 HDAC1 (0.58) HDAC1CES2MEN1KMT2AGAA
SCHEMBL27789123 0.98 HDAC1 (0.56) HDAC1CES2MEN1KMT2AGAA
SCHEMBL29375561 0.88 HDAC1 (0.58) HDAC1CES2MEN1KMT2AGAA
SCHEMBL759926 0.88 HDAC1 (0.58) HDAC1CES2MEN1KMT2AGAA
SCHEMBL29357695 0.87 CES2 (0.73) CES2MEN1KMT2AGAAUSP2
SCHEMBL39507 0.87 CES2 (0.73) CES2MEN1KMT2AGAAUSP2
SCHEMBL1758251 0.86 MEN1 (0.59) CES2MEN1KMT2AGAAUSP2
SCHEMBL3281937 0.86 CES2 (0.55) HDAC1CES2MEN1KMT2AGAA
SCHEMBL1063407 0.85 SELL (0.68) HDAC1MEN1KMT2AALDH1A1SELL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 755 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10494483-B2 Photosensitive resin composition, organic light emitting display device including the same, and method for manufacturing organic light emitting display device SAMSUNG DISPLAY CO., LTD. (KR) 2019-12-03 US claimed
US-20190339613-A1 Photosensitive Material For Lift-Off Applications GOLDEN JEREMY (US) 2019-11-07 US claimed
US-10409162-B2 Highly heat resistant polysilsesquioxane-based photosensitive resin composition LTC CO., LTD. (KR) 2019-09-10 US claimed
US-20170226294-A1 PHOTOSENSITIVE RESIN COMPOSITION, ORGANIC LIGHT EMITTING DISPLAY DEVICE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY DEVICE SAMSUNG DISPLAY CO., LTD. (KR) 2017-08-10 US claimed
US-20170166700-A1 HIGHLY HEAT RESISTANT POLYSILSESQUIOXANE-BASED PHOTOSENSITIVE RESIN COMPOSITION LTC CO., LTD. (KR) 2017-06-15 US claimed
EP-2203783-A2 THICK FILM RESISTS AZ Electronic Materials USA Corp. (US) 2010-07-07 EP claimed
WO-2009040661-A2 THICK FILM RESISTS AZ ELECTRONIC MATERIALS USA CORP. (DE) 2009-04-02 WO claimed
US-20090081589-A1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2009-03-26 US claimed
US-7008883-B2 Photoresist composition for forming an insulation film, insulation film for organic electroluminescence devices and process for producing the insulation film ZEON CORPORATION (JP) 2006-03-07 US claimed
EP-1623274-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-02-08 EP claimed
US-20040197696-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
EP-0827024-B1 Radiation-sensitive resin composition JSR CORP (JP) 2003-01-02 EP claimed
EP-0706090-B1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO LTD (JP) 2001-01-03 EP claimed
US-5958645-A ALKALI-SOLUBLE RESIN, PHENOL COMPOUND, 1,2-QUINONEDIAZIDE COMPOUND; RESOLUTION, SENSITIVITY, DEVELOPABILITY JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1999-09-28 US claimed
US-5798201-A AN ALKALI SOLUBLE RESIN AND A 1,2-QUINONEDIAZIDE-5-SULFONATE COMPOUND OF POLYPHENOL; RESIN IS SUITABLE FOR USE AS A POSITIVE PHOTORESIST, EXHIBITS EXCELLENT DEVELOPABILITY, HEAT RESISTANCE AND HIGH RESOLUTION JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-08-25 US claimed
EP-0827024-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-03-04 EP claimed
US-5576138-A MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1996-11-19 US claimed
US-5362598-A Compositions for light sensitive elements with styryl dyes SUMITOMO CHEMICAL CO., LTD. (JP) 1994-11-08 US claimed
US-5283324-A Reacting phenol compound and quinone diazide sulfonyl halide in solvent mixtures of different dielectric constants SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-02-01 US claimed