SCHEMBL759926

SCHEMBL759926

O=C(c1cc(O)ccc1O)c1ccc(O)c(O)c1O

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 1/20 0.58
CA12 O43570 5/20 0.55
CA1 P00915 5/20 0.55
CA2 P00918 5/20 0.55
CA7 P43166 5/20 0.55
CA9 Q16790 5/20 0.55
CA14 Q9ULX7 5/20 0.55
ALOX5 P09917 1/20 0.55
PTGS2 P35354 1/20 0.55
SELL P14151 1/20 0.52
SELP P16109 1/20 0.52
SIRT1 Q96EB6 2/20 0.51
HPGD P15428 2/20 0.48
ALOX15 P16050 2/20 0.48
CYP1A2 P05177 1/20 0.48
CYP2C9 P11712 1/20 0.48
CASP1 P29466 1/20 0.48
CYP2C19 P33261 1/20 0.48
CES2 O00748 1/20 0.47
ALDH1A1 P00352 2/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29375561 1.00 HDAC1 (0.58) HDAC1CA12CA1CA2CA7
SCHEMBL8861157 0.89 CA12 (0.52) HDAC1CA12CA1CA2CA7
SCHEMBL29071839 0.89 CA1 (0.68) HDAC1CA12CA1CA2CA7
SCHEMBL1397329 0.88 HDAC1 (0.58) HDAC1CA12CA1CA2CA7
SCHEMBL93552 0.88 HDAC1 (0.58) HDAC1CA12CA1CA2CA7
SCHEMBL29450717 0.88 HDAC1 (0.58) HDAC1CA12CA1CA2CA7
SCHEMBL3905124 0.87 CA12 (0.70) CA12CA1CA2CA7CA9
SCHEMBL27789123 0.86 HDAC1 (0.56) HDAC1CA12CA1CA2CA7
SCHEMBL9639957 0.86 CA12 (0.53) HDAC1CA12CA1CA2CA7
SCHEMBL1063407 0.85 SELL (0.68) HDAC1SELLSELPHPGDALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 319 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090081589-A1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2009-03-26 US claimed
EP-1623274-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-02-08 EP claimed
EP-1614005-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-01-11 EP claimed
US-6905809-B2 Photoresist compositions CLARIANT FINANCE (BVI) LIMITED (VG) 2005-06-14 US claimed
WO-2004088423-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
WO-2004088424-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
US-20040197696-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
US-20250376552-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-12-11 US disclosed
US-20250264801-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-08-21 US disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4596608-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4596607-A1 RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-0445819-A2 Positive type photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1991-09-11 EP disclosed
EP-0443533-A2 Positive photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1991-08-28 EP disclosed
EP-0435437-A1 Positive resist composition NIPPON ZEON CO., LTD. (JP) 1991-07-03 EP disclosed
EP-0430477-A1 Positive resist composition NIPPON ZEON CO., LTD. (JP) 1991-06-05 EP disclosed
US-4812551-A CRESOL OR PHENOL, PRINTED CIRCUITS SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1989-03-14 US disclosed
EP-0227487-A2 Positive type radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1987-07-01 EP disclosed