SCHEMBL29376325

SCHEMBL29376325

c1ccc(-c2cc(-c3ccccn3)[nH]n2)nc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PIN1 Q13526 1/20 0.57
KDM4E B2RXH2 5/20 0.56
LMNA P02545 3/20 0.56
CCR1 P32246 3/20 0.56
CCR5 P51681 3/20 0.56
CCR8 P51685 3/20 0.56
POLB P06746 3/20 0.56
CYP1A2 P05177 1/20 0.56
METAP1 P53582 1/20 0.56
BLM P54132 1/20 0.56
HIF1A Q16665 1/20 0.56
DOHH Q9BU89 1/20 0.56
P4HTM Q9NXG6 1/20 0.56
METAP2 P50579 1/20 0.48
RAB9A P51151 4/20 0.48
ALOX15 P16050 3/20 0.48
SMN1; SMN2 Q16637 3/20 0.48
L3MBTL1 Q9Y468 3/20 0.48
TP53 P04637 3/20 0.48
NPC1 O15118 3/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1528433 1.00 PIN1 (0.57) PIN1KDM4ELMNACCR1CCR5
SCHEMBL3385068 0.87 POLB (0.67) PIN1KDM4ELMNACCR1CCR5
SCHEMBL1528334 0.87 POLB (0.67) PIN1KDM4ELMNAPOLBCYP1A2
SCHEMBL17279982 0.85 POLB (0.55) PIN1KDM4ELMNACCR1CCR5
SCHEMBL17943308 0.81 MEN1 (0.61) KDM4ELMNAPOLBRAB9AALOX15
SCHEMBL17943413 0.81 HPGD (0.57) PIN1KDM4ELMNAPOLBMETAP1
SCHEMBL1702320 0.81 SMN1; SMN2 (0.47) PIN1KDM4ELMNACCR1CCR5
SCHEMBL2623420 0.81 KDM4E (0.46) PIN1KDM4ELMNACCR1CCR5
SCHEMBL13950333 0.81 KDM4E (0.46) PIN1KDM4ELMNACCR1CCR5
SCHEMBL3215516 0.78 L3MBTL1 (0.58) PIN1KDM4ELMNACCR1CCR5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025217208-A1 CHEMICAL MECHANICAL PLANARIZATION POLISHING FOR INTERCONNECTS DIFFUSION BARRIER MATERIALS VERSUM MATERIALS US, LLC (US) 2025-10-16 WO claimed
WO-2025217208-A1 CHEMICAL MECHANICAL PLANARIZATION POLISHING FOR INTERCONNECTS DIFFUSION BARRIER MATERIALS VERSUM MATERIALS US, LLC (US) 2025-10-16 WO disclosed
US-20250136843-A1 POLISHING COMPOSITION COMPRISING POLISHING PARTICLES HAVING HIGH WATER AFFINITY NISSAN CHEMICAL CORPORATION (JP) 2025-05-01 US disclosed
CN-119095930-A Polishing liquid, polishing liquid set and polishing method 株式会社力森诺科 2024-12-06 CN disclosed
CN-111587473-B Polishing composition using polishing particles having high water affinity 日产化学株式会社 2022-07-05 CN disclosed
CN-112004845-B Resin composition, laminate, semiconductor wafer with resin composition layer, substrate, and semiconductor device 三菱瓦斯化学株式会社 2022-05-31 CN disclosed
JP-2022070041-A RHODIUM CATALYST HAVING THREE OR MORE PROTON DONOR OR ACCEPTOR SITES 国立研究開発法人産業技術総合研究所 2022-05-12 JP disclosed
CN-114026195-A Polishing composition containing basic substance and using highly hydrophilic polishing particles 日产化学株式会社 2022-02-08 CN disclosed