Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NOS2 | P35228 | 1/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.48 |
| ▸ | MEN1 | O00255 | 2/20 | 0.48 |
| ▸ | POLB | P06746 | 2/20 | 0.48 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.47 |
| ▸ | LMNA | P02545 | 2/20 | 0.47 |
| ▸ | HTT | P42858 | 1/20 | 0.47 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.44 |
| ▸ | KARS1 | Q15046 | 3/20 | 0.42 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.42 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.42 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.42 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.41 |
| ▸ | CCR4 | P51679 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14980583 | 1.00 | NOS2 (0.50) | NOS2KMT2AMEN1POLBKDM4E | |
| SCHEMBL16491444 | 0.86 | NOS2 (0.49) | NOS2KMT2AMEN1POLBKDM4E | |
| SCHEMBL12698 | 0.83 | CYP2C19 (0.60) | NOS2KMT2AMEN1POLBLMNA | |
| SCHEMBL3597615 | 0.83 | LMNA (0.46) | KMT2AMEN1KDM4ELMNAHTT | |
| SCHEMBL19606436 | 0.81 | NOS2 (0.48) | NOS2KMT2AMEN1POLBKDM4E | |
| SCHEMBL11961829 | 0.81 | NOS2 (0.57) | NOS2KMT2AMEN1POLBKDM4E | |
| Hydrochloric Acid SCHEMBL7622407 | 0.80 | NOS2 (0.56) | NOS2KMT2AMEN1POLBKDM4E | |
| SCHEMBL11446324 | 0.79 | NOS2 (0.49) | NOS2KMT2AMEN1POLBKDM4E | |
| SCHEMBL827847 | 0.77 | NOS2 (0.61) | NOS2KMT2AMEN1POLBKDM4E | |
| SCHEMBL21139958 | 0.77 | SMN1; SMN2 (0.45) | NOS2KMT2AMEN1POLBKDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3452937-B1 | METHOD OF CHARACTERISING A DNA SAMPLE | GENOME RES LTD (GB) | 2025-10-22 | — | — | EP | disclosed |
| US-12264249-B2 | Curable composition for inkjet, cured product and flexible printed circuit board | MICROCOSM TECHNOLOGY CO., LTD. (TW) | 2025-04-01 | — | — | US | disclosed |
| CN-119095903-A | Photosensitive resin composition, dry film, cured product, printed circuit board and laminate | 韩国太阳油墨股份公司 | 2024-12-06 | — | — | CN | disclosed |
| CN-118922505-A | Composition and method for producing the same | 佐敦有限公司 | 2024-11-08 | — | — | CN | disclosed |
| CN-118786390-A | Curable resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-10-15 | — | — | CN | disclosed |
| WO-2024204265-A1 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD | 太陽ホールディングス株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2024195797-A1 | LAMINATED STRUCTURE, CURED PRODUCT, AND PRINTED WIRING BOARD | 太陽ホールディングス株式会社 | 2024-09-26 | — | — | WO | disclosed |
| US-12091767-B2 | Laminate and preparing method thereof | MICROCOSM TECHNOLOGY CO., LTD. (TW) | 2024-09-17 | — | — | US | disclosed |
| CN-111913354-B | Curable resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-09-03 | — | — | CN | disclosed |
| CN-111913353-B | Curable resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-09-03 | — | — | CN | disclosed |
| CN-114683633-A | Laminate and method for manufacturing same | 律胜科技股份有限公司 | 2022-07-01 | — | — | CN | disclosed |
| US-20220205123-A1 | Laminate and Preparing Method Thereof | MICROCOSM TECHNOLOGY CO., LTD. (TW) | 2022-06-30 | — | — | US | disclosed |
| WO-2022131762-A1 | SOLDER RESIST COMPOSITION, DRY FILM, PRINTED WIRING BOARD, AND METHODS FOR MANUFACTURING SAME | 한국다이요잉크 주식회사 | 2022-06-23 | — | — | WO | disclosed |
| CN-107436535-B | Photosensitive resin composition, dry film, cured product and printed wiring board | 太阳油墨制造株式会社 | 2022-06-10 | — | — | CN | disclosed |
| CN-114616303-A | Primer composition for adhesive bonding and method of using the same | 塞特工业公司 | 2022-06-10 | — | — | CN | disclosed |
| CN-114521247-A | Photocurable black composition, cured product of photocurable black composition, and black cover substrate | 太阳油墨制造株式会社 | 2022-05-20 | — | — | CN | disclosed |
| WO-2022082425-A1 | INKJET-USE HARDENABLE COMPOSITION, HARDENER, AND FLEXIBLE PRINTED CIRCUIT BOARD | 律胜科技股份有限公司 | 2022-04-28 | — | — | WO | disclosed |
| CN-110537395-B | Curable resin composition, dry film, cured product thereof, and printed wiring board | 太阳油墨制造株式会社 | 2022-03-25 | — | — | CN | disclosed |
| CN-108884345-B | Curable composition for inkjet, cured product, and printed wiring board | 太阳油墨制造株式会社 | 2022-02-25 | — | — | CN | disclosed |
| CN-108333877-B | Photosensitive film laminate and cured product formed using same | 太阳油墨制造株式会社 | 2022-02-25 | — | — | CN | disclosed |