Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 2/20 | 0.61 |
| ▸ | SRD5A2 | P31213 | 3/20 | 0.57 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.51 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.49 |
| ▸ | HPSE | Q9Y251 | 1/20 | 0.49 |
| ▸ | APEX1 | P27695 | 1/20 | 0.49 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.49 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.48 |
| ▸ | LMNA | P02545 | 1/20 | 0.48 |
| ▸ | KLKB1 | P03952 | 1/20 | 0.46 |
| ▸ | CTSB | P07858 | 1/20 | 0.46 |
| ▸ | MMP9 | P14780 | 1/20 | 0.46 |
| ▸ | DNMT1 | P26358 | 1/20 | 0.46 |
| ▸ | DNMT3B | Q9UBC3 | 1/20 | 0.46 |
| ▸ | DNMT3L | Q9UJW3 | 1/20 | 0.46 |
| ▸ | DNMT3A | Q9Y6K1 | 1/20 | 0.46 |
| ▸ | HNF4A | P41235 | 1/20 | 0.45 |
| ▸ | CASP6 | P55212 | 2/20 | 0.44 |
| ▸ | CDC25B | P30305 | 1/20 | 0.44 |
| ▸ | RCE1 | Q9Y256 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1099442 | 1.00 | POLB (0.61) | POLBSRD5A2ALDH1A1L3MBTL1HPSE | |
| SCHEMBL4738181 | 0.89 | POLB (0.61) | POLBSRD5A2ALDH1A1L3MBTL1HPSE | |
| SCHEMBL30553345 | 0.89 | POLB (0.73) | POLBALDH1A1L3MBTL1HPSEAPEX1 | |
| SCHEMBL30901880 | 0.89 | POLB (0.73) | POLBALDH1A1L3MBTL1HPSEAPEX1 | |
| SCHEMBL29406842 | 0.89 | POLB (0.73) | POLBALDH1A1L3MBTL1HPSEAPEX1 | |
| SCHEMBL145176 | 0.89 | POLB (0.73) | POLBALDH1A1L3MBTL1HPSEAPEX1 | |
| SCHEMBL262311 | 0.89 | POLB (0.73) | POLBALDH1A1L3MBTL1HPSEAPEX1 | |
| SCHEMBL11738052 | 0.88 | POLB (0.50) | POLBSRD5A2ALDH1A1L3MBTL1HPSE | |
| SCHEMBL49365 | 0.87 | POLB (0.70) | POLBALDH1A1L3MBTL1HPSEAPEX1 | |
| SCHEMBL29426403 | 0.87 | POLB (0.70) | POLBALDH1A1L3MBTL1HPSEAPEX1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100585-A1 | CURABLE RESIN COMPOSITION, PREPREG, AND CURED PRODUCTS THEREOF | 日本化薬株式会社 | 2026-05-15 | — | — | WO | disclosed |
| CN-117480190-B | Curable resin composition for printed wiring board and cured product thereof | 日本化药株式会社 | 2025-04-08 | — | — | CN | disclosed |
| CN-119654353-A | Compound, curable resin composition, and cured product thereof | 日本化药株式会社 | 2025-03-18 | — | — | CN | disclosed |
| CN-118139906-B | Phenol resin, epoxy resin, curable resin composition, and cured product thereof | 日本化药株式会社 | 2025-02-25 | — | — | CN | disclosed |
| CN-119278222-A | Curable resin composition, resin sheet, and cured product | 日本化药株式会社 | 2025-01-07 | — | — | CN | disclosed |
| CN-113227047-B | Maleimide resin, curable resin composition, and cured product thereof | 日本化药株式会社 | 2024-12-17 | — | — | CN | disclosed |
| CN-119081111-A | Resin composition | 旭化成株式会社 | 2024-12-06 | — | — | CN | disclosed |
| CN-118974107-A | Maleimide compound, curable resin composition, cured product thereof, amine compound, and reactant of amine compound and maleic anhydride | 日本化药株式会社 | 2024-11-15 | — | — | CN | disclosed |
| CN-117279962-B | Maleimide resin, curable resin composition, and cured product thereof | 日本化药株式会社 | 2024-11-01 | — | — | CN | disclosed |
| CN-118852618-A | Resin composition | 旭化成株式会社 | 2024-10-29 | — | — | CN | disclosed |
| CN-115215873-A | Novel diazaspiro compounds and uses thereof | SK新技术株式会社 | 2022-10-21 | — | — | CN | disclosed |
| WO-2022210415-A1 | MULTILAYER BODY, CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT COMPRISING SAID CURED PRODUCT | 太陽インキ製造株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022211086-A1 | POLYIMIDE, RESIN COMPOSITION, POLYIMIDE FILM, AND PRODUCTION METHOD THEREFOR | 旭化成株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022181764-A1 | MULTILAYER STRUCTURE AND FLEXIBLE PRINTED WIRING BOARD | 太陽インキ製造株式会社 | 2022-09-01 | — | — | WO | disclosed |
| CN-114650979-A | Compound, mixture, curable resin composition, cured product thereof, and method for producing compound | 日本化药株式会社 | 2022-06-21 | — | — | CN | disclosed |
| CN-114058324-B | Thermosetting resin composition and use thereof | 东洋油墨SC控股株式会社 | 2022-06-17 | — | — | CN | disclosed |
| CN-114174422-A | Resin composition, semiconductor sealing material using same, and dipping base material, circuit board, build-up film, prepreg, carbon fiber composite material, solder resist, dry film, and printed wiring board | DIC株式会社 | 2022-03-11 | — | — | CN | disclosed |
| CN-114133359-A | Diamine compound, method for preparing the same, and composition comprising the same | SK新技术株式会社 | 2022-03-04 | — | — | CN | disclosed |
| CN-114133563-A | Polyimide precursor, polyimide precursor composition, polyimide film, method for producing same, and use thereof | SK新技术株式会社 | 2022-03-04 | — | — | CN | disclosed |
| CN-114058324-A | Thermosetting resin composition and use thereof | 东洋油墨SC控股株式会社 | 2022-02-18 | — | — | CN | disclosed |