SCHEMBL1099442

SCHEMBL1099442

O=C(O)c1ccc(Oc2ccc(Cc3ccc(Oc4ccc(C(=O)O)c(C(=O)O)c4)cc3)cc2)cc1C(=O)O

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ POLB P06746 2/20 0.61
▸ SRD5A2 P31213 3/20 0.57
▸ ALDH1A1 P00352 2/20 0.51
▸ L3MBTL1 Q9Y468 2/20 0.49
▸ HPSE Q9Y251 1/20 0.49
▸ APEX1 P27695 1/20 0.49
▸ CTDSP1 Q9GZU7 1/20 0.49
▸ TDP1 Q9NUW8 3/20 0.48
▸ LMNA P02545 1/20 0.48
▸ KLKB1 P03952 1/20 0.46
▸ CTSB P07858 1/20 0.46
▸ MMP9 P14780 1/20 0.46
▸ DNMT1 P26358 1/20 0.46
▸ DNMT3B Q9UBC3 1/20 0.46
▸ DNMT3L Q9UJW3 1/20 0.46
▸ DNMT3A Q9Y6K1 1/20 0.46
▸ HNF4A P41235 1/20 0.45
▸ CASP6 P55212 2/20 0.44
▸ CDC25B P30305 1/20 0.44
▸ RCE1 Q9Y256 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29394890 1.00 POLB (0.61) POLBSRD5A2ALDH1A1L3MBTL1HPSE
SCHEMBL4738181 0.89 POLB (0.61) POLBSRD5A2ALDH1A1L3MBTL1HPSE
SCHEMBL30553345 0.89 POLB (0.73) POLBALDH1A1L3MBTL1HPSEAPEX1
SCHEMBL30901880 0.89 POLB (0.73) POLBALDH1A1L3MBTL1HPSEAPEX1
SCHEMBL29406842 0.89 POLB (0.73) POLBALDH1A1L3MBTL1HPSEAPEX1
SCHEMBL145176 0.89 POLB (0.73) POLBALDH1A1L3MBTL1HPSEAPEX1
SCHEMBL262311 0.89 POLB (0.73) POLBALDH1A1L3MBTL1HPSEAPEX1
SCHEMBL11738052 0.88 POLB (0.50) POLBSRD5A2ALDH1A1L3MBTL1HPSE
SCHEMBL49365 0.87 POLB (0.70) POLBALDH1A1L3MBTL1HPSEAPEX1
SCHEMBL29426403 0.87 POLB (0.70) POLBALDH1A1L3MBTL1HPSEAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 132 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024067649-A1 DIAMINE COMPOUND, POLYIMIDE ACID, POLYIMIDE, AND PREPARATION METHOD THEREFOR AND USE THEREOF 比亚迪股份有限公司 2024-04-04 — — WO claimed
US-20260117059-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, PREPREG, LAMINATE, AND SEMICONDUCTOR SUBSTRATE NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-30 — — US disclosed
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 — — US disclosed
US-20260109854-A1 CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 — — US disclosed
US-20260109801-A1 MALEIMIDE RESIN MIXTURE, CURABLE RESIN COMPOSITION, VARNISH, AND CURED PRODUCT THEREOF NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 — — US disclosed
US-20260078208-A1 COMPOUND, CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-03-19 — — US disclosed
EP-4641693-A1 POLYIMIDE COMPOUND, NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERIES THAT USES SAID POLYIMIDE COMPOUND, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERIES, AND LITHIUM ION SECONDARY BATTERY Wingo Technology Co., Ltd. (JP) 2025-10-29 — — EP disclosed
US-12410281-B2 Diamine compound, polyimide precursor and polyimide film using the same, and use thereof SK INNOVATION CO., LTD. (KR) 2025-09-09 — — US disclosed
US-12269949-B2 Polyimide compound and molded article comprising the polyimide compound WINGO TECHNOLOGY CO., LTD. (JP) 2025-04-08 — — US disclosed
WO-2025063083-A1 COMPOUND, METHOD FOR PRODUCING SAME, CURABLE RESIN COMPOSITION, AND CURED PRODUCT OF SAME 日本化薬株式会社 2025-03-27 — — WO disclosed
US-20030220455-A1 Comprises epoxy resins and polyimides; for printed circuits and semiconductor packages SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-11-27 — — US disclosed
US-20030158350-A1 Heat resistant resin composition and adhesive film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-08-21 — — US disclosed
US-20030092870-A1 Novel aromatic diamine and polyimide thereof MITSUI CHEMICALS, INC. (JP) 2003-05-15 — — US disclosed
EP-1288191-A2 Novel aromatic diamine and polyimide thereof Mitsui Chemicals, Inc. (JP) 2003-03-05 — — EP disclosed
US-6316170-B2 COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT KABUSHIKI KAISHA TOSHIBA (JP) 2001-11-13 — — US disclosed
US-20010006767-A1 Developing solution and method of forming polyimide pattern by using the developing solution YOSHIAKI KAWAMONZEN 2001-07-05 — — US disclosed
US-6183934-B1 FOE USE IN FORMATION OF PATTERN OF INSULATION FILM, PASSIVATION FILM, .ALPHA.-RAY SHIELDING FILM, OPTICAL WAVEGUIDE KABUSHIKI KAISHA TOSHIBA (JP) 2001-02-06 — — US disclosed
US-6159654-A Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating KABUSHIKI KAISHA TOSHIBA (JP) 2000-12-12 — — US disclosed
US-6001517-A A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT KABUSHIKI KAISHA TOSHIBA (JP) 1999-12-14 — — US disclosed
US-5756650-A COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-26 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (7 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109854-A1 CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF MLLT1, CRBN, POT1 POLB 3606/4885SRD5A2 3905/4885ALDH1A1 2301/4885
US-20030092870-A1 Novel aromatic diamine and polyimide thereof DDT, AOC1, H1-4 POLB 1669/4885SRD5A2 3906/4885ALDH1A1 902/4885
US-20260109801-A1 MALEIMIDE RESIN MIXTURE, CURABLE RESIN COMPOSITION, VARNISH, AND CURED PRODUCT THEREOF SMC4, MECP2, SMC3 POLB 1529/4885SRD5A2 3593/4885ALDH1A1 3246/4885
US-20260117059-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, PREPREG, LAMINATE, AND SEMICONDUCTOR SUBSTRATE RAD51, ASH2L, H1-0 POLB 1783/4885SRD5A2 2907/4885ALDH1A1 2221/4885
US-20260078208-A1 COMPOUND, CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME BMI1, SEM1, PSMB2 POLB 1928/4885SRD5A2 2823/4885ALDH1A1 552/4885
US-12410281-B2 Diamine compound, polyimide precursor and polyimide film using the same, and use thereof PUF60, PARG, DDT POLB 1592/4885SRD5A2 4630/4885ALDH1A1 1920/4885
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 POLB 981/4885SRD5A2 2893/4885ALDH1A1 438/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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