SCHEMBL29396129

SCHEMBL29396129

O=C1C=C(CCOCCC2=CC(=O)NC2=O)C(=O)N1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18920918 0.98 MGLL (0.30)
SCHEMBL29395784 0.98 MGLL (0.30)
SCHEMBL29393241 0.98 MGLL (0.30)
SCHEMBL28516591 0.90 RXFP1 (0.31)
Hydrochloric Acid SCHEMBL19668439 0.89
Hydrochloric Acid SCHEMBL29260717 0.86
SCHEMBL1398019 0.85 GSK3A (0.32)
Water SCHEMBL28158179 0.83 GSK3A (0.30)
SCHEMBL30834591 0.83 DAO (0.33)
SCHEMBL5703319 0.81 STAT3 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118355077-A Resin composition, laminate, prepreg, cured product, substrate with cured product, and electronic device 爱天思株式会社 2024-07-16 CN disclosed
CN-118222091-A Resin composition, laminate, prepreg, cured product, substrate with cured product, and electronic device 爱天思株式会社 2024-06-21 CN disclosed
CN-117751690-A Adhesive resin sheet, printed wiring board, and electronic device 爱天思株式会社 2024-03-22 CN disclosed
CN-114058324-B Thermosetting resin composition and use thereof 东洋油墨SC控股株式会社 2022-06-17 CN disclosed
CN-114058324-A Thermosetting resin composition and use thereof 东洋油墨SC控股株式会社 2022-02-18 CN disclosed