Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 6/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.52 |
| ▸ | MEN1 | O00255 | 2/20 | 0.52 |
| ▸ | GAA | P10253 | 2/20 | 0.52 |
| ▸ | MAPT | P10636 | 2/20 | 0.52 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.52 |
| ▸ | PKM | P14618 | 1/20 | 0.52 |
| ▸ | RECQL | P46063 | 1/20 | 0.52 |
| ▸ | ALOX15 | P16050 | 4/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.50 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.50 |
| ▸ | KLF10 | Q13118 | 1/20 | 0.48 |
| ▸ | ESR2 | Q92731 | 4/20 | 0.47 |
| ▸ | HPGD | P15428 | 2/20 | 0.46 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.46 |
| ▸ | AR | P10275 | 2/20 | 0.46 |
| ▸ | TSHR | P16473 | 2/20 | 0.46 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.46 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.46 |
| ▸ | HTR6 | P50406 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29412591 | 1.00 | ESR1 (0.56) | ESR1ALDH1A1MEN1GAAMAPT | |
| SCHEMBL565076 | 1.00 | ESR1 (0.56) | ESR1ALDH1A1MEN1GAAMAPT | |
| SCHEMBL564039 | 0.92 | ESR1 (0.61) | ESR1ALDH1A1MEN1GAAMAPT | |
| SCHEMBL8515161 | 0.92 | ALDH1A1 (0.66) | ESR1ALDH1A1MEN1GAAMAPT | |
| SCHEMBL564979 | 0.92 | ESR1 (0.48) | ESR1ALDH1A1MEN1GAAMAPT | |
| SCHEMBL565312 | 0.90 | ESR1 (0.57) | ESR1ALDH1A1MEN1GAAMAPT | |
| SCHEMBL29045724 | 0.87 | GAA (0.69) | ESR1ALDH1A1MEN1GAAMAPT | |
| SCHEMBL564555 | 0.87 | ESR1 (0.50) | ESR1ALDH1A1MEN1GAAMAPT | |
| SCHEMBL9687133 | 0.87 | ESR1 (0.44) | ESR1ALDH1A1MEN1GAAMAPT | |
| SCHEMBL564539 | 0.87 | ESR1 (0.55) | ESR1ALDH1A1MEN1GAAMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120077104-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-05-30 | — | — | CN | disclosed |
| CN-116648313-B | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2025-05-16 | — | — | CN | disclosed |
| CN-119998728-A | Film manufacturing method, photosensitive resin composition, cured product manufacturing method, cured product, and laminate | 富士胶片株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119968421-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-05-09 | — | — | CN | disclosed |
| CN-119937247-A | Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2025-05-06 | — | — | CN | disclosed |
| CN-119403880-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-02-07 | — | — | CN | disclosed |
| CN-118679426-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2024-09-20 | — | — | CN | disclosed |
| CN-114981360-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-09-10 | — | — | CN | disclosed |
| CN-118435349-A | Method for producing joined body, method for producing laminate, method for producing device, and composition for forming polyimide-containing precursor portion | 富士胶片株式会社 | 2024-08-02 | — | — | CN | disclosed |
| CN-115667404-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-05-03 | — | — | CN | disclosed |
| WO-2022059621-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022059622-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022050041-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022050135-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022050278-A1 | CURABLE RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, SEMICONDUCTOR DEVICE, AND PHOTOBASE GENERATOR | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022045124-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045123-A1 | METHOD FOR PRODUCING POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING CURABLE RESIN COMPOSITION | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045120-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR MANUFACTURING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045059-A1 | RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045060-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |