SCHEMBL29433705

SCHEMBL29433705

Cc1ccccc1C(C)C#N

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.46
TSHR P16473 3/20 0.43
ACHE P22303 1/20 0.39
ALDH1A1 P00352 2/20 0.39
MEN1 O00255 1/20 0.39
LMNA P02545 1/20 0.39
MAPT P10636 1/20 0.39
KMT2A Q03164 1/20 0.39
NPSR1 Q6W5P4 1/20 0.39
ACP3 P15309 1/20 0.36
SGMS2 Q8NHU3 2/20 0.35
SLC6A2 P23975 1/20 0.34
SLC6A4 P31645 1/20 0.34
SLC6A3 Q01959 1/20 0.34
GAA P10253 1/20 0.34
ADRA2A P08913 1/20 0.34
ADRA2B P18089 1/20 0.34
ADRA2C P18825 1/20 0.34
GABRA1 P14867 1/20 0.33
GABRB2 P47870 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL954806 1.00 ESR1 (0.46) ESR1TSHRACHEALDH1A1MEN1
SCHEMBL8763608 0.85 TSHR (0.42) ESR1TSHRALDH1A1LMNASLC6A2
SCHEMBL697021 0.83 TSHR (0.42) ESR1TSHRACHEALDH1A1MEN1
SCHEMBL31485919 0.83 TSHR (0.42) ESR1TSHRACHEALDH1A1MEN1
SCHEMBL8763258 0.81 CA1 (0.34) ESR1TSHRALDH1A1MEN1LMNA
SCHEMBL7030620 0.79 ESR1 (0.48) ESR1TSHRACHEALDH1A1MEN1
SCHEMBL29031397 0.79 ESR1 (0.48) ESR1TSHRACHEALDH1A1MEN1
SCHEMBL8751146 0.78 ESR1 (0.43) ESR1TSHRACHEALDH1A1MEN1
SCHEMBL910441 0.77 ESR1 (0.46) ESR1TSHRACHEALDH1A1MEN1
SCHEMBL1612103 0.77 ESR1 (0.46) ESR1TSHRACHEALDH1A1ACP3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115768832-A Resin composition, method for producing same, and method for producing composition for pattern formation 富士胶片株式会社 2023-03-07 CN disclosed
CN-115190891-A Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2022-10-14 CN disclosed
CN-115103871-A Resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2022-09-23 CN disclosed
CN-115038755-A Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2022-09-09 CN disclosed
CN-114981360-A Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2022-08-30 CN disclosed
CN-114761466-A Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2022-07-15 CN disclosed
CN-114730145-A Pattern forming method, photocurable resin composition, method for producing laminate, and method for producing electronic device 富士胶片株式会社 2022-07-08 CN disclosed
CN-114730132-A Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2022-07-08 CN disclosed
CN-108700836-B Method for manufacturing laminate and method for manufacturing semiconductor device 富士胶片株式会社 2022-06-28 CN disclosed
CN-114514470-A Pattern forming method, photosensitive resin composition, method for manufacturing laminate, and method for manufacturing semiconductor device 富士胶片株式会社 2022-05-17 CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
WO-2022059621-A1 RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2022-03-24 WO disclosed