SCHEMBL2943474

SCHEMBL2943474

c1ccc2c(Cc3nc4ccccc4[nH]3)cccc2c1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
EGFR P00533 2/20 0.75
ERBB2 P04626 1/20 0.75
HTT P42858 2/20 0.69
MEN1 O00255 1/20 0.69
KMT2A Q03164 1/20 0.69
GAA P10253 2/20 0.58
KRAS P01116 1/20 0.56
ADRA2A P08913 1/20 0.55
ADRA2B P18089 1/20 0.55
ADRA2C P18825 1/20 0.55
PKM P14618 2/20 0.55
LMNA P02545 2/20 0.55
MAPT P10636 1/20 0.55
HKDC1 Q2TB90 1/20 0.55
HTR6 P50406 2/20 0.54
DDAH1 O94760 1/20 0.53
POLB P06746 1/20 0.53
TSHR P16473 1/20 0.51
PDE10A Q9Y233 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30583065 1.00 EGFR (0.75) EGFRERBB2HTTMEN1KMT2A
SCHEMBL29413820 1.00 EGFR (0.75) EGFRERBB2HTTMEN1KMT2A
SCHEMBL30702409 0.86 MEN1 (0.68) EGFRERBB2HTTMEN1KMT2A
SCHEMBL8027033 0.86 MEN1 (0.68) EGFRERBB2HTTMEN1KMT2A
SCHEMBL31305516 0.83 POLB (0.66) EGFRERBB2HTTMEN1KMT2A
SCHEMBL26110106 0.83 POLB (0.71) EGFRERBB2HTTMEN1KMT2A
SCHEMBL26113024 0.83 POLB (0.66) EGFRERBB2HTTMEN1KMT2A
SCHEMBL31305510 0.83 POLB (0.71) EGFRERBB2HTTMEN1KMT2A
SCHEMBL8037089 0.83 EGFR (0.55) EGFRERBB2HTTMEN1KMT2A
SCHEMBL8043227 0.83 EGFR (0.55) EGFRERBB2HTTMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118002982-A Organic solderability preservative and preparation method and application thereof 广东省科学院化工研究所 2024-05-10 CN claimed
JP-10251866-A None JP disclosed
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
CN-118002982-A Organic solderability preservative and preparation method and application thereof 广东省科学院化工研究所 2024-05-10 CN disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
CN-116810216-A Water-soluble pre-flux and surface treatment method 株式会社田村制作所 2023-09-29 CN disclosed
CN-106802536-B Transfer material, method for producing same, laminate, and method for producing same 富士胶片株式会社 2022-03-04 CN disclosed
CN-110716668-A Transfer film, laminate, method for producing same, and use thereof 富士胶片株式会社 2020-01-21 CN disclosed
US-10192651-B2 Transfer material, method of manufacturing transfer material, laminated body, method of manufacturing laminated body, method of manufacturing capacitance-type input device, and method of manufacturing image display device FUJIFILM CORPORATION (JP) 2019-01-29 US disclosed
EP-1829987-A2 Surface treating agent and method for manufacturing coating using the same MEC COMPANY LTD. (JP) 2007-09-05 EP disclosed
US-20050173678-A1 Surface treatment agents for metal films of printed circuit boards TAMURA KAKEN CORPORATION (JP) 2005-08-11 US disclosed
EP-0818562-B1 Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO LTD (JP) 2000-03-22 EP disclosed
EP-0791671-B1 Surface treating agent for copper or copper alloy SHIKOKU CHEM (JP) 1999-06-16 EP disclosed
JP-H10251866-A SURFACE TREATING AGENT FOR COPPER AND COPPER ALLOY SHIKOKU CHEM CORP 1998-09-22 JP disclosed
US-5795409-A MIXTURE OF A (BENZ)IMIDAZOLE COMPOUND, CHELATE COMPOUND AND IRON SHIKOKU CHEMICALS CORPORATION (JP) 1998-08-18 US disclosed
EP-0818562-A1 Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO., Ltd. (JP) 1998-01-14 EP disclosed
EP-0791671-A1 Surface treating agent for copper or copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1997-08-27 EP disclosed
US-5496590-A Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO., LTD. (JP) 1996-03-05 US disclosed
EP-0643154-A2 Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO., Ltd. (JP) 1995-03-15 EP disclosed