SCHEMBL8037089

SCHEMBL8037089

Cc1ccc2[nH]c(Cc3cccc4ccccc34)nc2c1

nearest known ligand 0.70

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
EGFR P00533 1/20 0.55
ERBB2 P04626 1/20 0.55
KMT2A Q03164 3/20 0.50
MEN1 O00255 2/20 0.50
HTT P42858 1/20 0.50
HTR6 P50406 2/20 0.47
KRAS P01116 1/20 0.46
ADRA2A P08913 1/20 0.45
ADRA2B P18089 1/20 0.45
ADRA2C P18825 1/20 0.45
GAA P10253 1/20 0.43
NPC1 O15118 2/20 0.43
RAB9A P51151 2/20 0.43
SMN1; SMN2 Q16637 2/20 0.43
LMNA P02545 1/20 0.43
MAPT P10636 1/20 0.43
POLB P06746 1/20 0.42
ALDH1A1 P00352 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8043227 0.84 EGFR (0.55) EGFRERBB2KMT2AMEN1HTT
SCHEMBL30583065 0.83 EGFR (0.75) EGFRERBB2KMT2AMEN1HTT
SCHEMBL29413820 0.83 EGFR (0.75) EGFRERBB2KMT2AMEN1HTT
SCHEMBL2943474 0.83 EGFR (0.75) EGFRERBB2KMT2AMEN1HTT
SCHEMBL25735980 0.82 KRAS (0.60) KMT2AMEN1HTTKRASGAA
SCHEMBL8973995 0.80 GAA (0.68) EGFRERBB2KMT2AGAANPC1
SCHEMBL8974006 0.75 KMT2A (0.55) EGFRKMT2AMEN1GAANPC1
SCHEMBL10578747 0.74 EGFR (0.43) EGFRERBB2KMT2AMEN1HTT
SCHEMBL6368176 0.73 GAA (0.58) EGFRKMT2AMEN1HTTKRAS
SCHEMBL22955874 0.73 ALDH1A1 (0.52) KMT2AMEN1HTTGAANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0818562-B1 Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO LTD (JP) 2000-03-22 EP disclosed
EP-0818562-A1 Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO., Ltd. (JP) 1998-01-14 EP disclosed
US-5496590-A Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO., LTD. (JP) 1996-03-05 US disclosed
EP-0643154-A2 Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO., Ltd. (JP) 1995-03-15 EP disclosed