SCHEMBL8043227

SCHEMBL8043227

Clc1ccc2[nH]c(Cc3cccc4ccccc34)nc2c1

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EGFR P00533 4/20 0.55
ERBB2 P04626 2/20 0.55
HTT P42858 2/20 0.50
MEN1 O00255 1/20 0.50
KMT2A Q03164 1/20 0.50
POLB P06746 1/20 0.48
ADRA2A P08913 1/20 0.48
ADRA2B P18089 1/20 0.48
ADRA2C P18825 1/20 0.48
HTR6 P50406 2/20 0.46
MAPT P10636 3/20 0.45
LMNA P02545 2/20 0.45
KDM4E B2RXH2 1/20 0.45
PDGFRB P09619 1/20 0.42
FLT1 P17948 1/20 0.42
KDR P35968 1/20 0.42
F10 P00742 1/20 0.42
PRNP P04156 1/20 0.42
GAA P10253 1/20 0.42
PKM P14618 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8037089 0.84 EGFR (0.55) EGFRERBB2HTTMEN1KMT2A
SCHEMBL29413820 0.83 EGFR (0.75) EGFRERBB2HTTMEN1KMT2A
SCHEMBL2943474 0.83 EGFR (0.75) EGFRERBB2HTTMEN1KMT2A
SCHEMBL30583065 0.83 EGFR (0.75) EGFRERBB2HTTMEN1KMT2A
SCHEMBL30956287 0.79 TDP1 (0.46) EGFRERBB2HTTPOLBMAPT
SCHEMBL4164834 0.79 GAA (0.66) EGFRERBB2KMT2AMAPTLMNA
SCHEMBL15644468 0.77 LCK (0.47) EGFRERBB2HTTMEN1KMT2A
SCHEMBL8585022 0.77 EGFR (0.53) EGFRERBB2HTTMEN1KMT2A
SCHEMBL18689826 0.77 RAB9A (0.53) EGFRERBB2HTTMEN1KMT2A
SCHEMBL30956283 0.76 TDP1 (0.44) EGFRERBB2HTTMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106802536-B Transfer material, method for producing same, laminate, and method for producing same 富士胶片株式会社 2022-03-04 CN disclosed
CN-110716668-A Transfer film, laminate, method for producing same, and use thereof 富士胶片株式会社 2020-01-21 CN disclosed
US-10192651-B2 Transfer material, method of manufacturing transfer material, laminated body, method of manufacturing laminated body, method of manufacturing capacitance-type input device, and method of manufacturing image display device FUJIFILM CORPORATION (JP) 2019-01-29 US disclosed
US-10157695-B2 2018-12-18 US disclosed
US-10059087-B2 Transfer film, method for manufacturing transfer film, laminate, method for manufacturing laminate, capacitive input device, and image display device FUJIFILM CORPORATION (JP) 2018-08-28 US disclosed
US-20170154704-A1 TRANSFER MATERIAL, METHOD OF MANUFACTURING TRANSFER MATERIAL, LAMINATED BODY, METHOD OF MANUFACTURING LAMINATED BODY, METHOD OF MANUFACTURING CAPACITANCE-TYPE INPUT DEVICE, AND METHOD OF MANUFACTURING IMAGE DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2017-06-01 US disclosed
CN-106660309-A Transfer film, method for manufacturing transfer film, laminate, method for manufacturing laminate, capacitance-type input device, and image display device 富士胶片株式会社 2017-05-10 CN disclosed
US-20170095999-A1 TRANSFER FILM, METHOD FOR MANUFACTURING TRANSFER FILM, LAMINATE, METHOD FOR MANUFACTURING LAMINATE, CAPACITIVE INPUT DEVICE, AND IMAGE DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2017-04-06 US disclosed
EP-0818562-B1 Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO LTD (JP) 2000-03-22 EP disclosed
EP-0818562-A1 Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO., Ltd. (JP) 1998-01-14 EP disclosed
US-5496590-A Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO., LTD. (JP) 1996-03-05 US disclosed
EP-0643154-A2 Composition for treating copper and copper alloy surfaces and method for the surface treatment MEC CO., Ltd. (JP) 1995-03-15 EP disclosed