SCHEMBL29439366

SCHEMBL29439366

COc1ccccc1N1C(=O)C=CC1=O

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 9/20 1.00
TLR9 Q9NR96 2/20 0.61
G6PD P11413 1/20 0.61
KMT2A Q03164 3/20 0.54
MEN1 O00255 2/20 0.54
FAAH O00519 1/20 0.52
ALDH1A1 P00352 2/20 0.51
HSP90AA1 P07900 1/20 0.51
MAPT P10636 1/20 0.51
PKM P14618 1/20 0.51
MAPK1 P28482 1/20 0.51
RAB9A P51151 1/20 0.51
CCR6 P51684 1/20 0.51
CACNA1B Q00975 1/20 0.51
APBA1 Q02410 1/20 0.51
NPSR1 Q6W5P4 1/20 0.51
APOBEC3G Q9HC16 1/20 0.51
GAA P10253 2/20 0.51
CASP3 P42574 1/20 0.51
CASP6 P55212 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL141734 1.00 MGLL (1.00) MGLLTLR9G6PDKMT2AMEN1
SCHEMBL9418786 0.90 MGLL (0.81) MGLLTLR9G6PDKMT2AMEN1
SCHEMBL10769331 0.85 MGLL (0.73) MGLLTLR9G6PDKMT2AMEN1
SCHEMBL9320871 0.83 MGLL (0.71) MGLLTLR9G6PDFAAHALDH1A1
SCHEMBL11346699 0.82 MGLL (0.69) MGLLTLR9G6PDKMT2AMEN1
SCHEMBL9162087 0.82 MGLL (0.69) MGLLTLR9G6PDKMT2AMEN1
SCHEMBL10398325 0.82 MGLL (0.69) MGLLTLR9G6PDFAAHALDH1A1
SCHEMBL10834529 0.79 MGLL (0.66) MGLLTLR9G6PDFAAHALDH1A1
SCHEMBL3691135 0.79 MGLL (0.66) MGLLTLR9FAAHALDH1A1MAPT
SCHEMBL29168849 0.78 KMT2A (0.76) MGLLKMT2AMEN1ALDH1A1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120153013-A Prepreg, laminate, printed wiring board, and semiconductor package 株式会社力森诺科 2025-06-13 CN disclosed
CN-119937243-A Chemically amplified positive photosensitive resin composition, cured film, and element having cured film 奇美实业股份有限公司 2025-05-06 CN disclosed
CN-119698450-A Adhesive sheet and method for producing laminate 积水化学工业株式会社 2025-03-25 CN disclosed
CN-119676951-A Laminate, method for producing same, and use thereof DIC株式会社 2025-03-21 CN disclosed
CN-119654386-A Ultraviolet curable adhesive composition and method for producing laminate 积水化学工业株式会社 2025-03-18 CN disclosed
CN-119630750-A Photo-curable pressure-sensitive adhesive composition for printing, cured product, and laminate 积水化学工业株式会社 2025-03-14 CN disclosed
CN-119463010-A Pellets, molded article, and method for producing molded article 旭化成株式会社 2025-02-18 CN disclosed
CN-119427637-A Method for producing plate-shaped molded article 旭化成株式会社 2025-02-14 CN disclosed
CN-113466971-B Resin prism for polarizing beam splitter 旭化成株式会社 2024-12-13 CN disclosed
CN-119110828-A Thermosetting resin composition, prepreg, resin film, laminate, printed wiring board, antenna device, antenna module, and communication device 株式会社力森诺科 2024-12-10 CN disclosed
CN-115826360-A Photosensitive polyimide composition, method for producing pattern, cured product, and electronic component 江苏艾森半导体材料股份有限公司 2023-03-21 CN disclosed
CN-112812219-B Methacrylic resin and method for producing same, methacrylic resin composition, molded article, and automobile part 旭化成株式会社 2023-02-17 CN disclosed
CN-115552069-A A fiber treating agent a fiber-treating composition fiber processed product and method for producing fiber treatment agent 昭和电工株式会社 2022-12-30 CN disclosed
CN-112939915-B Diamine monomer for photosensitive resin, polyimide precursor, photosensitive resin composition, and use thereof 武汉柔显科技股份有限公司 2022-10-14 CN disclosed
CN-114805667-A Methacrylic resin, molded article, optical member, or automobile member 旭化成株式会社 2022-07-29 CN disclosed
CN-109791352-B Photosensitive resin composition, method for producing conductive pattern, substrate, touch panel, and display 东丽株式会社 2022-07-29 CN disclosed
CN-114746458-A Aqueous resin composition, coating film, and method for forming coating film 昭和电工株式会社 2022-07-12 CN disclosed
WO-2022102780-A1 MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE 昭和電工マテリアルズ株式会社 2022-05-19 WO disclosed
CN-114432301-A Covalent inhibitor derivative and application thereof in treating virus infection 北京大学 2022-05-06 CN disclosed
CN-112552630-B Resin composition, resin glue solution containing resin composition, prepreg, laminated board, copper-clad plate and printed circuit board 广东生益科技股份有限公司 2022-03-18 CN disclosed