SCHEMBL9320871

SCHEMBL9320871

O=C1C=CC(=O)N1c1ccccc1Oc1ccccc1N1C(=O)C=CC1=O

nearest known ligand 0.71

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 14/20 0.71
TLR9 Q9NR96 3/20 0.67
FAAH O00519 4/20 0.50
ALDH1A1 P00352 1/20 0.46
HSP90AA1 P07900 1/20 0.46
PKM P14618 1/20 0.46
CCR6 P51684 1/20 0.46
ATM Q13315 1/20 0.46
NPSR1 Q6W5P4 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
G6PD P11413 1/20 0.46
NR1H2 P55055 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10398325 0.98 MGLL (0.69) MGLLTLR9FAAHALDH1A1HSP90AA1
SCHEMBL29754607 0.90 MGLL (0.65) MGLLTLR9FAAHALDH1A1HSP90AA1
SCHEMBL31180045 0.89 MGLL (0.64) MGLLTLR9FAAHALDH1A1HSP90AA1
SCHEMBL31179947 0.89 MGLL (0.64) MGLLTLR9FAAHALDH1A1HSP90AA1
SCHEMBL2814012 0.88 MGLL (0.62) MGLLTLR9FAAHALDH1A1HSP90AA1
SCHEMBL28802341 0.86 MGLL (0.56) MGLLTLR9FAAHALDH1A1HSP90AA1
SCHEMBL31180001 0.85 MGLL (0.59) MGLLTLR9FAAHALDH1A1HSP90AA1
SCHEMBL31180005 0.85 MGLL (0.54) MGLLTLR9FAAHALDH1A1HSP90AA1
SCHEMBL9564015 0.85 MGLL (0.58) MGLLTLR9FAAHALDH1A1HSP90AA1
SCHEMBL31179988 0.85 MGLL (0.54) MGLLTLR9FAAHALDH1A1HSP90AA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-2294312-A None JP disclosed
JP-4285615-A None JP disclosed
CN-109689742-B Curable resin mixture and method for producing curable resin composition 昭和电工株式会社 2021-12-10 CN disclosed
EP-0310424-B1 Thermosetting resin composition MITSUI PETROCHEMICAL IND (JP) 1994-01-05 EP disclosed
JP-H04285615-A RESIN COMPOSITION FOR SEALING SEMICONDUCTOR MITSUBISHI KASEI CORP 1992-10-09 JP disclosed
US-4985478-A Aminobismaleimide, unsaturated epoxy compound, sheet molding compound MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1991-01-15 US disclosed
JP-H02294312-A THERMOSETTING COMPOSITION MITSUBISHI KASEI CORP 1990-12-05 JP disclosed