SCHEMBL2944564

SCHEMBL2944564

CC(=O)C1=C(C)N(O)C(C)=C(C(C)=O)C1(O)c1ccccc1[N+](=O)[O-]

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 2/20 0.39
MAPT P10636 4/20 0.37
KDM4E B2RXH2 4/20 0.37
THRB P10828 1/20 0.37
TDP1 Q9NUW8 3/20 0.37
TSHR P16473 3/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
ALDH1A1 P00352 4/20 0.36
SMN1; SMN2 Q16637 3/20 0.36
RAB9A P51151 2/20 0.36
KMT2A Q03164 2/20 0.36
ATM Q13315 1/20 0.36
MEN1 O00255 1/20 0.36
NPC1 O15118 1/20 0.36
MAOB P27338 1/20 0.35
ABCC4 O15439 1/20 0.34
PLIN1 O60240 1/20 0.34
CACNA1F O60840 1/20 0.34
GMNN O75496 1/20 0.34
KCNK2 O95069 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8896632 0.89 TSHR (0.42) HSD17B10MAPTKDM4ETDP1TSHR
SCHEMBL2907995 0.84 ALDH1A1 (0.44) MAPTKDM4EL3MBTL1ALDH1A1SMN1; SMN2
SCHEMBL19040319 0.70 ALDH1A1 (0.48) HSD17B10MAPTTHRBTDP1ALDH1A1
SCHEMBL7351539 0.69 MAPT (0.37) HSD17B10MAPTKDM4ETDP1TSHR
SCHEMBL4880017 0.66 TSHR (0.38) HSD17B10MAPTKDM4ETHRBTDP1
SCHEMBL9396727 0.65 KMT2A (0.40) HSD17B10TDP1TSHRALDH1A1KMT2A
Acetic Acid SCHEMBL27721273 0.65 HSD17B10 (0.58) HSD17B10MAPTTHRBTDP1TSHR
Acetamide SCHEMBL27891614 0.65 PLAU (0.49) HSD17B10THRBTDP1TSHRL3MBTL1
SCHEMBL4755372 0.64 TSHR (0.39) HSD17B10MAPTKDM4ETDP1TSHR
SCHEMBL334763 0.64 ALDH1A1 (0.63) HSD17B10MAPTKDM4ETDP1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111684359-A Photosensitive transfer material, method for manufacturing circuit wiring, and method for manufacturing touch panel 富士胶片株式会社 2020-09-18 CN disclosed
EP-1331517-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR ITS PREPARATION, AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO (JP) 2010-08-18 EP disclosed
US-6908717-B2 Positive photosensitive resin composition, process for its preparation, and semiconductor devices SUMITOMO BAKELITE COMPANY LIMITED (JP) 2005-06-21 US disclosed
US-20040023147-A1 Positive photosensitive resin composition, process for its preparation, and semiconductor devices SUMITOMO BAKELITE COMPANY LIMITED (JP) 2004-02-05 US disclosed
EP-1331517-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR ITS PREPARATION, AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-30 EP disclosed