Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BCL2 | P10415 | 1/20 | 0.59 |
| ▸ | BCL2L1 | Q07817 | 1/20 | 0.59 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.55 |
| ▸ | ELANE | P08246 | 2/20 | 0.53 |
| ▸ | CTSG | P08311 | 1/20 | 0.53 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.52 |
| ▸ | HSPA5 | P11021 | 1/20 | 0.50 |
| ▸ | HPGD | P15428 | 2/20 | 0.48 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.48 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.48 |
| ▸ | MEN1 | O00255 | 1/20 | 0.48 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.48 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.48 |
| ▸ | ADAMTS4 | O75173 | 1/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.46 |
| ▸ | EGFR | P00533 | 1/20 | 0.46 |
| ▸ | CA1 | P00915 | 1/20 | 0.46 |
| ▸ | CA2 | P00918 | 1/20 | 0.46 |
| ▸ | LMNA | P02545 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29091169 | 0.98 | BCL2 (0.57) | BCL2BCL2L1KEAP1ELANECTSG | |
| SCHEMBL4966037 | 0.89 | BCL2 (0.60) | BCL2BCL2L1KEAP1ELANECTSG | |
| SCHEMBL31198170 | 0.87 | BCL2 (0.48) | BCL2BCL2L1KEAP1ELANECTSG | |
| SCHEMBL87816 | 0.84 | KEAP1 (0.75) | BCL2BCL2L1KEAP1ALOX5HSPA5 | |
| SCHEMBL30335116 | 0.84 | KEAP1 (0.75) | BCL2BCL2L1KEAP1ALOX5HSPA5 | |
| SCHEMBL7782321 | 0.84 | HSPA5 (0.64) | KEAP1HSPA5HPGDALOX15HSD17B10 | |
| SCHEMBL2788678 | 0.84 | HSPA5 (0.62) | KEAP1HSPA5HPGDALOX15HSD17B10 | |
| SCHEMBL29450504 | 0.83 | BCL2 (0.59) | BCL2BCL2L1ELANECTSGALOX5 | |
| SCHEMBL278522 | 0.83 | BCL2 (0.59) | BCL2BCL2L1ELANECTSGALOX5 | |
| SCHEMBL28998999 | 0.82 | KEAP1 (0.72) | BCL2BCL2L1KEAP1ALOX5HSPA5 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10202474-B2 | Process for producing polydienes | BRIDGESTONE CORPORATION (JP) | 2019-02-12 | — | — | US | claimed |
| CN-108948106-A | A kind of preparation method of 2- hydroxyl gulose receptor derivative, bleomycin disaccharides and its precursor | 广州中医药大学(广州中医药研究院) | 2018-12-07 | — | — | CN | claimed |
| CN-106928030-A | The method that hydroxytyrosol is prepared using organo-metallic compound | 广州南沙龙沙有限公司 | 2017-07-07 | — | — | CN | claimed |
| US-20170073443-A1 | PROCESS FOR PRODUCING POLYDIENES | BRIDGESTONE CORPORATION (US) | 2017-03-16 | — | — | US | claimed |
| EP-1041448-B1 | Method for decoloring | TOSHIBA KK (JP) | 2006-06-07 | — | — | EP | claimed |
| US-6326332-B1 | HEATING | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-12-04 | — | — | US | claimed |
| EP-1041448-A1 | Decolorable material and method for decoloring the same | Kabushiki Kaisha Toshiba (JP) | 2000-10-04 | — | — | EP | claimed |
| US-20240329525-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-10-03 | — | — | US | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| EP-3613790-B1 | NEW FORMULATION METHODOLOGY FOR DISTORTIONAL THERMOSETS | BOEING CO (US) | 2023-11-01 | — | — | EP | disclosed |
| CN-116693740-A | Method for preparing polymer gel material by oxygen initiation | 复旦大学 | 2023-09-05 | — | — | CN | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |
| US-20200409263-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| EP-0565732-B1 | BENZODIOXANE DERIVATIVE | CHUGAI PHARMACEUTICAL CO LTD (JP) | 1998-01-14 | — | — | EP | disclosed |
| US-5545678-A | CONTAINING EPOXIDE OR CARBONATE WITH AMINE AND PHENOL | HOECHST AKTIENGESELLSCHAFT (DE) | 1996-08-13 | — | — | US | disclosed |
| US-5480905-A | ANTIDEPRESSANTS, ANXIOLYTIC AGENTS | CHUGAI SEIYAKU KABUSHIKI KAISHA (JP) | 1996-01-02 | — | — | US | disclosed |
| EP-0565732-A1 | BENZODIOXANE DERIVATIVE | Chugai Seiyaku Kabushiki Kaisha (JP) | 1993-10-20 | — | — | EP | disclosed |
| WO-1992010601-A1 | PROCESS FOR STRETCHING FIBERS AND FORMING COMPOSITE ARTICLES | ALLIED-SIGNAL INC. (US) | 1992-06-25 | — | — | WO | disclosed |
| US-5087548-A | POSITIVE TYPE RADIATION-SENSITIVE RESIN COMPOSITION | JAPAN SYNTHETIC RUBBER CO., INC. (JP) | 1992-02-11 | — | — | US | disclosed |
| EP-0227487-A2 | Positive type radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1987-07-01 | — | — | EP | disclosed |