SCHEMBL29475151

SCHEMBL29475151

Cc1cc(Oc2ccc(N)cc2)c(C)c(C)c1Oc1ccc(N)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.50
SMN1; SMN2 Q16637 3/20 0.50
TEAD4 Q15561 1/20 0.48
MAPT P10636 5/20 0.47
TDP1 Q9NUW8 4/20 0.47
POLB P06746 1/20 0.47
CYP3A4 P08684 2/20 0.46
TSHR P16473 1/20 0.46
MEN1 O00255 3/20 0.42
KMT2A Q03164 3/20 0.42
MITF O75030 1/20 0.42
GAA P10253 1/20 0.42
GFER P55789 1/20 0.42
NLRP1 Q9C000 1/20 0.42
NOD2 Q9HC29 1/20 0.42
MAOA P21397 2/20 0.41
MAPK1 P28482 3/20 0.40
NPC1 O15118 2/20 0.40
RAB9A P51151 2/20 0.40
HPGD P15428 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1352574 1.00 ALDH1A1 (0.50) ALDH1A1SMN1; SMN2TEAD4MAPTTDP1
SCHEMBL15945517 0.95 TEAD4 (0.58) ALDH1A1SMN1; SMN2TEAD4MAPTTDP1
SCHEMBL10001986 0.85 LMNA (0.45) ALDH1A1SMN1; SMN2TEAD4MAPTTDP1
SCHEMBL12323953 0.82 ALDH1A1 (0.47) ALDH1A1SMN1; SMN2TEAD4MAPTTDP1
SCHEMBL11316203 0.81 MEN1 (0.46) SMN1; SMN2MEN1KMT2A
SCHEMBL31179977 0.81 MAPT (0.53) ALDH1A1SMN1; SMN2MAPTPOLBCYP3A4
SCHEMBL10804584 0.80 ALDH1A1 (0.57) ALDH1A1SMN1; SMN2TEAD4MAPTTDP1
SCHEMBL31179951 0.80 TEAD4 (0.60) ALDH1A1SMN1; SMN2TEAD4MAPTTDP1
SCHEMBL9321941 0.79 ALDH1A1 (0.67) ALDH1A1SMN1; SMN2TEAD4MAPTTDP1
SCHEMBL31179939 0.79 ALDH1A1 (0.67) ALDH1A1SMN1; SMN2TEAD4MAPTTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112368330-B Thermoplastic resin composition and method for producing same 大金工业株式会社 2023-03-21 CN claimed
CN-118772377-A Urea epoxy curing accelerator, epoxy conductive silver adhesive and preparation method 汉方新材料科技(嘉善)有限公司 2024-10-15 CN disclosed
CN-114716707-B Polyimide film, copper-clad laminate, and circuit board 日铁化学材料株式会社 2024-10-11 CN disclosed
CN-116802560-A Photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film 旭化成株式会社 2023-09-22 CN disclosed
CN-112368330-B Thermoplastic resin composition and method for producing same 大金工业株式会社 2023-03-21 CN disclosed
CN-114716707-A Polyimide film, copper sheet laminated plate, and circuit board 日铁化学材料株式会社 2022-07-08 CN disclosed
CN-111770963-B Thermoplastic resin composition and method for producing same 大金工业株式会社 2022-06-28 CN disclosed
CN-114207522-A Negative photosensitive resin composition, method for producing polyimide, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-03-18 CN disclosed