Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC6A4 | P31645 | 1/20 | 0.41 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.41 |
| ▸ | KDR | P35968 | 1/20 | 0.41 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.41 |
| ▸ | OPRD1 | P41143 | 1/20 | 0.37 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.37 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.34 |
| ▸ | MIF | P14174 | 1/20 | 0.34 |
| ▸ | HTR2A | P28223 | 1/20 | 0.34 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.34 |
| ▸ | HTR2B | P41595 | 1/20 | 0.34 |
| ▸ | FEN1 | P39748 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2516717 | 1.00 | SLC6A4 (0.41) | SLC6A4OPRM1KDRSLC6A3OPRD1 | |
| SCHEMBL8964164 | 0.88 | CYP19A1 (0.36) | OPRM1OPRD1OPRK1FEN1ALDH1A1 | |
| SCHEMBL29484422 | 0.85 | KDM4E (0.35) | MIFFEN1 | |
| SCHEMBL2512536 | 0.85 | KDM4E (0.35) | MIFFEN1 | |
| SCHEMBL17222749 | 0.84 | SLC6A4 (0.31) | SLC6A4OPRM1KDRSLC6A3 | |
| SCHEMBL8038990 | 0.83 | ADRB2 (0.40) | ADRB1ADRA1AALDH1A1POLB | |
| SCHEMBL29376176 | 0.81 | NUDT1 (0.44) | SLC6A4OPRM1KDRSLC6A3OPRD1 | |
| SCHEMBL761321 | 0.81 | NUDT1 (0.44) | SLC6A4OPRM1KDRSLC6A3OPRD1 | |
| SCHEMBL30899189 | 0.81 | NUDT1 (0.44) | SLC6A4OPRM1KDRSLC6A3OPRD1 | |
| SCHEMBL27675462 | 0.81 | NUDT1 (0.44) | SLC6A4OPRM1KDRSLC6A3OPRD1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119575759-A | Positive photosensitive resin composition, photosensitive film, resist underlayer film, resist permanent film, and method for producing film | DIC株式会社 | 2025-03-07 | — | — | CN | disclosed |
| CN-118672058-A | Photosensitive resin composition, resist film, resist underlayer film, and resist permanent film | DIC株式会社 | 2024-09-20 | — | — | CN | disclosed |
| CN-116209690-B | Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin | DIC株式会社 | 2024-09-06 | — | — | CN | disclosed |
| CN-118325004-A | Phenolic hydroxyl group-containing resin, photosensitive resin composition, curable composition, and resist film | DIC株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-114902135-B | Positive photosensitive resin composition, cured film, and resist film | DIC株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-113348188-B | Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product | DIC株式会社 | 2024-05-10 | — | — | CN | disclosed |
| CN-117321109-A | Phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-12-29 | — | — | CN | disclosed |
| CN-113227181-B | Resist composition | DIC株式会社 | 2023-07-18 | — | — | CN | disclosed |
| CN-116430671-A | Photoresist composition and photoetching process | 上海飞凯材料科技股份有限公司 | 2023-07-14 | — | — | CN | disclosed |
| CN-110959138-B | Resist material | DIC株式会社 | 2023-06-30 | — | — | CN | disclosed |
| CN-116209690-A | Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-06-02 | — | — | CN | disclosed |
| CN-116023607-A | Phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-04-28 | — | — | CN | disclosed |
| CN-115873214-A | Epoxy resin, photosensitive resin composition, resist film, curable composition, and cured film | DIC株式会社 | 2023-03-31 | — | — | CN | disclosed |
| CN-107703717-B | Positive photosensitive resin composition, method for producing metal wiring, and laminate | 东京应化工业株式会社 | 2023-01-24 | — | — | CN | disclosed |
| CN-114902135-A | Positive photosensitive resin composition, cured film and resist film | DIC株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-114326300-A | Positive photoresist composition, preparation method and photoresist pattern forming method | 上海飞凯材料科技股份有限公司 | 2022-04-12 | — | — | CN | disclosed |
| WO-2022065041-A1 | RESIN CONTAINING PHENOLIC HYDROXYL GROUP, RESIN COMPOSITION FOR ALKALI-DEVELOPABLE RESISTS, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING RESIN CONTAINING PHENOLIC HYDROXYL GROUP | DIC株式会社 | 2022-03-31 | — | — | WO | disclosed |
| WO-2022059448-A1 | METHOD FOR PRODUCING RESIST PATTERN, RESIST PATTERN AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR PRODUCTION OF TRANSPARENT MULTILAYER MEMBER | DIC株式会社 | 2022-03-24 | — | — | WO | disclosed |
| CN-107703685-B | Laminate and method for producing laminate | 东京应化工业株式会社 | 2022-03-18 | — | — | CN | disclosed |