SCHEMBL29488305

SCHEMBL29488305

Nc1ccc(-c2cccc(-c3ccc(N)c(O)c3)c2)cc1O

nearest known ligand 0.81

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 3/20 0.81
HSD17B10 Q99714 2/20 0.81
CYP3A4 P08684 2/20 0.81
APP P05067 2/20 0.62
MEN1 O00255 4/20 0.54
KMT2A Q03164 4/20 0.54
KDM4E B2RXH2 2/20 0.54
GAA P10253 2/20 0.54
MAPT P10636 2/20 0.54
USP2 O75604 1/20 0.54
ALDH1A1 P00352 1/20 0.54
LMNA P02545 1/20 0.54
HSP90AA1 P07900 1/20 0.54
HPGD P15428 1/20 0.54
ALOX12 P18054 1/20 0.54
HTT P42858 1/20 0.54
ESR1 P03372 1/20 0.52
ALOX5 P09917 2/20 0.48
POLB P06746 1/20 0.46
RAB9A P51151 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16949848 1.00 ALOX15 (0.81) ALOX15HSD17B10CYP3A4APPMEN1
SCHEMBL23924225 0.90 CYP3A4 (1.00) ALOX15HSD17B10CYP3A4APPMEN1
SCHEMBL105866 0.90 CYP3A4 (1.00) ALOX15HSD17B10CYP3A4APPMEN1
SCHEMBL29365557 0.90 CYP3A4 (1.00) ALOX15HSD17B10CYP3A4APPMEN1
SCHEMBL29549758 0.90 CYP3A4 (1.00) ALOX15HSD17B10CYP3A4APPMEN1
SCHEMBL564901 0.89 CYP3A4 (0.71) ALOX15HSD17B10CYP3A4APPMEN1
SCHEMBL564219 0.89 CYP3A4 (0.71) ALOX15HSD17B10CYP3A4APPMEN1
SCHEMBL565193 0.88 ALOX15 (0.77) ALOX15HSD17B10CYP3A4APPMEN1
Methane SCHEMBL3324869 0.87 CYP3A4 (0.94) ALOX15HSD17B10CYP3A4APPMEN1
Ammonia Solution, Strong SCHEMBL6653834 0.87 CYP3A4 (0.94) ALOX15HSD17B10CYP3A4APPMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023032888-A1 ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 東レ株式会社 2023-03-09 WO disclosed
CN-110734736-B Adhesive for temporary bonding, adhesive layer, wafer processed body, and method for manufacturing semiconductor device using same 东丽株式会社 2022-04-19 CN disclosed