SCHEMBL29488307

SCHEMBL29488307

Cc1ccc2c(c1)-c1ccccc1C2(c1ccc(N)cc1)c1ccc(N)cc1

nearest known ligand 0.73

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.73
MEN1 O00255 2/20 0.73
KMT2A Q03164 2/20 0.73
KDM4E B2RXH2 1/20 0.73
MAPT P10636 1/20 0.73
OPRK1 P41145 1/20 0.73
SMN1; SMN2 Q16637 1/20 0.73
PDK2 Q15119 7/20 0.51
ESR1 P03372 1/20 0.49
ESR2 Q92731 1/20 0.49
POLB P06746 2/20 0.41
ACHE P22303 1/20 0.39
KIF11 P52732 1/20 0.38
ELANE P08246 1/20 0.38
NPSR1 Q6W5P4 2/20 0.36
ALDH1A1 P00352 1/20 0.34
PLA2G7 Q13093 1/20 0.33
CASP3 P42574 1/20 0.33
RAB9A P51151 1/20 0.33
ATM Q13315 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4657935 1.00 LMNA (0.73) LMNAMEN1KMT2AKDM4EMAPT
SCHEMBL29579958 0.92 LMNA (0.71) LMNAMEN1KMT2AKDM4EMAPT
SCHEMBL7055099 0.92 LMNA (0.71) LMNAMEN1KMT2AKDM4EMAPT
SCHEMBL9973087 0.91 MEN1 (0.81) LMNAMEN1KMT2AKDM4EMAPT
SCHEMBL29579515 0.88 SMN1; SMN2 (0.55) LMNAMEN1KMT2AKDM4EMAPT
SCHEMBL8750566 0.88 SMN1; SMN2 (0.55) LMNAMEN1KMT2AKDM4EMAPT
SCHEMBL21975849 0.88 PDK2 (0.56) LMNAMEN1KMT2AKDM4EMAPT
SCHEMBL105428 0.86 MAPT (1.00) LMNAMEN1KMT2AKDM4EMAPT
SCHEMBL29392989 0.86 MAPT (1.00) LMNAMEN1KMT2AKDM4EMAPT
SCHEMBL29426418 0.86 MAPT (1.00) LMNAMEN1KMT2AKDM4EMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110734736-B Adhesive for temporary bonding, adhesive layer, wafer processed body, and method for manufacturing semiconductor device using same 东丽株式会社 2022-04-19 CN disclosed