SCHEMBL7055099

SCHEMBL7055099

Cc1ccc2c(c1)C(c1ccc(N)cc1)(c1ccc(N)cc1)c1ccccc1-2

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 4/20 0.71
SMN1; SMN2 Q16637 3/20 0.71
MEN1 O00255 3/20 0.71
KMT2A Q03164 3/20 0.71
KDM4E B2RXH2 2/20 0.71
MAPT P10636 2/20 0.71
OPRK1 P41145 1/20 0.71
ESR1 P03372 1/20 0.47
ESR2 Q92731 1/20 0.47
PDK2 Q15119 8/20 0.46
POLB P06746 3/20 0.41
ACHE P22303 1/20 0.38
KIF11 P52732 1/20 0.37
ELANE P08246 1/20 0.37
PTPRC P08575 2/20 0.36
NPC1 O15118 2/20 0.36
ALDH1A1 P00352 2/20 0.36
HPGD P15428 2/20 0.36
RAB9A P51151 2/20 0.36
NPSR1 Q6W5P4 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29579958 1.00 LMNA (0.71) LMNASMN1; SMN2MEN1KMT2AKDM4E
SCHEMBL4657935 0.92 LMNA (0.73) LMNASMN1; SMN2MEN1KMT2AKDM4E
SCHEMBL29488307 0.92 LMNA (0.73) LMNASMN1; SMN2MEN1KMT2AKDM4E
SCHEMBL27043573 0.92 SMN1; SMN2 (0.55) LMNASMN1; SMN2MEN1KMT2AKDM4E
SCHEMBL18468636 0.90 SMN1; SMN2 (0.66) LMNASMN1; SMN2MEN1KMT2AKDM4E
SCHEMBL29579515 0.90 SMN1; SMN2 (0.55) LMNASMN1; SMN2MEN1KMT2AKDM4E
SCHEMBL8750566 0.90 SMN1; SMN2 (0.55) LMNASMN1; SMN2MEN1KMT2AKDM4E
SCHEMBL9973087 0.90 MEN1 (0.81) LMNASMN1; SMN2MEN1KMT2AKDM4E
SCHEMBL24254783 0.87 SMN1; SMN2 (0.50) LMNASMN1; SMN2MEN1KMT2AKDM4E
SCHEMBL13326482 0.87 SMN1; SMN2 (0.50) LMNASMN1; SMN2MEN1KMT2AKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2900726-B1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LTD (GB) 2020-04-08 EP claimed
EP-2900726-A2 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN Hexcel Composites Limited (GB) 2015-08-05 EP claimed
US-20150210847-A1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LIMITED (GB) 2015-07-30 US claimed
US-20240024828-A1 HALOGEN-SUBSTITUTED 9,9-BIS(4-AMINOPHENYL)FLUORENE BASED POLYIMIDE MEMBRANES FOR GAS SEPARATION APPLICATIONS SAUDI ARABIAN OIL COMPANY (SA) 2024-01-25 US disclosed
US-11370908-B2 Curable compositions and related methods 3M INNOVATIVE PROPERTIES COMPANY (US) 2022-06-28 US disclosed
US-20220080553-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M INNOVATIVE PROPERTIES CO (US) 2022-03-17 US disclosed
US-20220001514-A1 ABRASIVE ARTICLE WITH MICROPARTICLE-COATED ABRASIVE GRAINS 3M INNOVATIVE PROPERTIES COMPANY 2022-01-06 US disclosed
US-20210363289-A1 RESIN COMPOSITIONS AND RESIN INFUSION PROCESS CYTEC INDUSTRIES INC. (US) 2021-11-25 US disclosed
EP-3898097-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M Innovative Properties Company (US) 2021-10-27 EP disclosed
US-20210292545-A1 PREPREG TORAY INDUSTRIES, INC. (JP) 2021-09-23 US disclosed
US-11111333-B2 Resin compositions and resin infusion process CYTEC INDUSTRIES INC. (US) 2021-09-07 US disclosed
US-5728755-A EXHIBIT TACK AND GOOD SHELF LIFE, LITTLE RESIN MIGRATION AND GLASS TRANSITION TEMPERATURE SIMILAR TO THOSE CURED NEAT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1998-03-17 US disclosed
EP-0591313-B1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING & MFG (US) 1997-04-02 EP disclosed
US-5432010-A Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-07-11 US disclosed
US-5369192-A Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-11-29 US disclosed
EP-0591313-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS. MINNESOTA MINING & MFG (US) 1994-04-13 EP disclosed
WO-1993000675-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1993-01-07 WO disclosed
EP-0203828-B1 EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-03-28 EP disclosed
US-4684678-A POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-08-04 US disclosed
EP-0203828-A1 Epoxy resin curing agent, curing process and composition containing it MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1986-12-03 EP disclosed