SCHEMBL29520753

SCHEMBL29520753

Fc1ccccc1[B-](c1ccccc1F)(c1ccccc1F)c1ccccc1F.c1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ACHE P22303 1/20 0.31
NFE2L2 Q16236 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL123954 0.83 ACHE (0.41) ACHENFE2L2
SCHEMBL29830966 0.81 ACHE (0.39) ACHENFE2L2
Silver SCHEMBL1450856 0.81 ACHE (0.39) ACHENFE2L2
SCHEMBL1452107 0.81 ACHE (0.39) ACHENFE2L2
Lithium Ion SCHEMBL912832 0.81 ACHE (0.39) ACHENFE2L2
SCHEMBL1450796 0.81 ACHE (0.39) ACHENFE2L2
Lithium Ion SCHEMBL29567735 0.81 ACHE (0.39) ACHENFE2L2
Bromide SCHEMBL7211405 0.79 ACHE (0.38) ACHENFE2L2
Bromide SCHEMBL7211403 0.79 ACHE (0.38) ACHENFE2L2
SCHEMBL20841980 0.75 ACHE (0.35) ACHENFE2L2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250298315-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-09-25 US disclosed
CN-120202438-A Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method and light emitting element 信越化学工业株式会社 2025-06-24 CN disclosed
CN-120092212-A Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method and light emitting element 信越化学工业株式会社 2025-06-03 CN disclosed
CN-120019329-A Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method and light emitting element 信越化学工业株式会社 2025-05-16 CN disclosed
CN-119987132-A Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film and pattern forming method 信越化学工业株式会社 2025-05-13 CN disclosed
CN-111142332-B Photosensitive resin composition and photosensitive dry film 信越化学工业株式会社 2024-10-29 CN disclosed
CN-110297398-B Photosensitive resin composition, photosensitive resin laminate, and pattern forming method 信越化学工业株式会社 2024-10-08 CN disclosed
CN-118103774-A Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and pattern forming method 信越化学工业株式会社 2024-05-28 CN disclosed
CN-117794985-A Polymer containing silicon phenylene skeleton, photosensitive resin composition, pattern forming method, and method for producing optical semiconductor element 信越化学工业株式会社 2024-03-29 CN disclosed
CN-111381447-B Photosensitive resin composition, laminate, and pattern forming method 信越化学工业株式会社 2024-03-08 CN disclosed
CN-117120927-A Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, and pattern forming method 信越化学工业株式会社 2023-11-24 CN disclosed
CN-111234236-B Siloxane polymer containing isocyanuric acid and polyether skeleton, photosensitive resin composition, and pattern formation method 信越化学工业株式会社 2023-03-24 CN disclosed
CN-111205463-B Polysiloxane skeleton polymer, photosensitive resin composition, pattern forming method and manufacturing of optical semiconductor device 信越化学工业株式会社 2023-02-14 CN disclosed
CN-115023653-A Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, and pattern formation method 信越化学工业株式会社 2022-09-06 CN disclosed
CN-114746809-A Photosensitive resin composition, photosensitive resin coating film, photosensitive dry film, pattern forming method, and light-emitting element 信越化学工业株式会社 2022-07-12 CN disclosed
CN-109422881-B Epoxy group-containing isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern formation method 信越化学工业株式会社 2022-04-19 CN disclosed
CN-114253069-A Photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, and surface protective film 信越化学工业株式会社 2022-03-29 CN disclosed