Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.50 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.50 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.46 |
| ▸ | MEN1 | O00255 | 5/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 5/20 | 0.43 |
| ▸ | CES2 | O00748 | 1/20 | 0.42 |
| ▸ | CES1 | P23141 | 1/20 | 0.42 |
| ▸ | LMNA | P02545 | 3/20 | 0.40 |
| ▸ | MAPT | P10636 | 1/20 | 0.40 |
| ▸ | PTK2B | Q14289 | 1/20 | 0.39 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.39 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.39 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.38 |
| ▸ | GAA | P10253 | 1/20 | 0.38 |
| ▸ | SRC | P12931 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25397512 | 0.95 | MEN1 (0.46) | TSHRCYP3A4L3MBTL1MEN1KMT2A | |
| SCHEMBL3842119 | 0.95 | CES2 (0.46) | TSHRCYP3A4L3MBTL1CES2CES1 | |
| SCHEMBL14023392 | 0.90 | TSHR (0.41) | TSHRCYP3A4L3MBTL1MEN1KMT2A | |
| SCHEMBL328975 | 0.90 | CES2 (0.42) | TSHRCYP3A4L3MBTL1MEN1KMT2A | |
| SCHEMBL1011961 | 0.88 | MEN1 (0.41) | TSHRCYP3A4L3MBTL1MEN1KMT2A | |
| SCHEMBL6563116 | 0.88 | SRC (0.52) | L3MBTL1MEN1KMT2ACES2CES1 | |
| SCHEMBL272850 | 0.87 | INPPL1 (0.43) | L3MBTL1MEN1KMT2ALMNAMAPT | |
| P-Cresol SCHEMBL232531 | 0.86 | ACHE (0.45) | TSHRCYP3A4L3MBTL1MEN1KMT2A | |
| Toluene SCHEMBL29065788 | 0.86 | ACP3 (0.41) | TSHRL3MBTL1MEN1KMT2ALMNA | |
| SCHEMBL157866 | 0.85 | TSHR (0.67) | TSHRCYP3A4MEN1KMT2ACES2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 136 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230285789-A1 | FOAM FIRE EXTINGUISHING AGENT | YAMATO PROTEC CORPORATION (JP) | 2023-09-14 | — | — | US | claimed |
| EP-4169588-A1 | FOAM FIRE EXTINGUISHING AGENT | Yamato Protec Corporation (JP) | 2023-04-26 | — | — | EP | claimed |
| EP-3842494-B1 | POLYAMIDE COMPOSITION AND MOLDED PRODUCT COMPOSED OF SAID POLYAMIDE COMPOSITION | KURARAY CO (JP) | 2026-01-07 | — | — | EP | disclosed |
| US-12403437-B2 | Method for producing nanodiamonds doped with group 14 element, and method for purifying same | DAICEL CORPORATION (JP) | 2025-09-02 | — | — | US | disclosed |
| US-12351463-B2 | Heteroatom-doped nanodiamond | DAICEL CORPORATION (JP) | 2025-07-08 | — | — | US | disclosed |
| US-12324105-B2 | Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package | RESONAC CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| WO-2025070335-A1 | ELECTROMAGNETIC WAVE SHIELD FILM | タツタ電線株式会社 | 2025-04-03 | — | — | WO | disclosed |
| US-12264224-B2 | Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package | RESONAC CORPORATION (JP) | 2025-04-01 | — | — | US | disclosed |
| US-12234323-B2 | Transparent polyimide film and production method therefor | KANEKA CORPORATION (JP) | 2025-02-25 | — | — | US | disclosed |
| US-20250002355-A1 | HETEROATOM-DOPED NANODIAMOND PARTICLES AND METHOD FOR PRODUCING HETEROATOM-DOPED NANODIAMOND PARTICLES | DAICEL CORPORATION (JP) | 2025-01-02 | — | — | US | disclosed |
| WO-2024219059-A1 | NV CENTER-CONTAINING NANODIAMOND PARTICLE AND METHOD FOR PRODUCING SAME | 株式会社ダイセル | 2024-10-24 | — | — | WO | disclosed |
| US-20100075559-A1 | SYNTHETIC RESIN LEATHER | OKAMOTO INDUSTRIES, INC. (JP) | 2010-03-25 | — | — | US | disclosed |
| US-20100065301-A1 | Wire covering material composition, an insulated wire and a wiring harness | AUTONETWORKS TECHNOLOGIES, LTD. (JP) | 2010-03-18 | — | — | US | disclosed |
| CN-101512680-A | Composition for wire coating material, insulated wire, and wire harness | AUTONETWORKS TECHNOLOGIES LTD (JP) | 2009-08-19 | — | — | CN | disclosed |
| EP-1835068-A1 | SYNTHETIC RESIN LEATHER | Okamoto Industries, Inc. (JP) | 2007-09-19 | — | — | EP | disclosed |
| CN-1522387-A | Photosensitive resin composition, and photosensitive dry film resist and photosensitive coverlay film using the same | 钟渊化学工业株式会社 | 2004-08-18 | — | — | CN | disclosed |
| EP-1420047-A1 | Flame retardant resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2004-05-19 | — | — | EP | disclosed |
| EP-1391414-A1 | DOOR INSTALLED AT PLATFORM FOR ELEVATOR | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 2004-02-25 | — | — | EP | disclosed |
| US-6344508-B1 | Reclaimed pet resin composition, molded article thereof, and flame-retardant resin composition and molded article thereof | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2002-02-05 | — | — | US | disclosed |
| EP-1050559-A1 | RECLAIMED PET RESIN COMPOSITION, MOLDED ARTICLE THEREOF, AND FLAME-RETARDANT RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) | 2000-11-08 | — | — | EP | disclosed |