SCHEMBL29655555

SCHEMBL29655555

Oc1ccc2ccc(O)c(O)c2c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTPN22 Q9Y2R2 1/20 0.56
ESR1 P03372 6/20 0.44
ESR2 Q92731 6/20 0.44
MCL1 Q07820 1/20 0.44
CYP1A2 P05177 1/20 0.42
LMNA P02545 2/20 0.41
TDP1 Q9NUW8 2/20 0.40
CDK4 P11802 1/20 0.40
CCND1 P24385 1/20 0.40
MEN1 O00255 1/20 0.40
ALPL P05186 1/20 0.40
HSP90AA1 P07900 1/20 0.40
ALPI P09923 1/20 0.40
GAA P10253 1/20 0.40
MAPT P10636 1/20 0.40
ALPG P10696 1/20 0.40
CASP3 P42574 1/20 0.40
RECQL P46063 1/20 0.40
MMP14 P50281 1/20 0.40
KMT2A Q03164 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3212292 1.00 PTPN22 (0.56) PTPN22ESR1ESR2MCL1CYP1A2
SCHEMBL3213734 0.83 PTPN22 (0.54) PTPN22ESR1ESR2CYP1A2TDP1
SCHEMBL29720904 0.83 PTPN22 (0.54) PTPN22ESR1ESR2CYP1A2TDP1
SCHEMBL2773224 0.82 CYP1A2 (0.46) PTPN22ESR1ESR2CYP1A2TDP1
SCHEMBL2770679 0.82 CYP1A2 (0.46) PTPN22ESR1ESR2CYP1A2TDP1
SCHEMBL18068463 0.81 PTPN22 (0.56) PTPN22ESR1ESR2MCL1CYP1A2
SCHEMBL670670 0.81 CYP1A2 (0.52) ESR1ESR2MCL1CYP1A2LMNA
SCHEMBL9578030 0.81 PTPN22 (0.76) PTPN22ESR1ESR2CYP1A2LMNA
SCHEMBL29085467 0.80 CYP17A1 (0.46) ESR1ESR2MCL1CYP1A2LMNA
SCHEMBL12251173 0.80 ESR1 (0.44) PTPN22ESR1ESR2MCL1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118459761-A Allyl naphthalene phenolic oligomer modified bismaleimide resin and preparation method thereof 华东理工大学 2024-08-09 CN disclosed
WO-2023233896-A1 PHOTOSENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2023-12-07 WO disclosed
WO-2023233895-A1 POLYIMIDE RESIN PRECURSOR 東京応化工業株式会社 2023-12-07 WO disclosed
CN-114258511-A Curable composition, cured product, and method for forming insulating film 东京应化工业株式会社 2022-03-29 CN disclosed