SCHEMBL29683063

SCHEMBL29683063

CC(=O)Nc1ccc(Cl)cc1F

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.62
HSD17B10 Q99714 1/20 0.62
KMT2A Q03164 4/20 0.61
HDAC1 Q13547 2/20 0.58
HDAC6 Q9UBN7 1/20 0.58
CA1 P00915 2/20 0.57
CA2 P00918 2/20 0.57
CA9 Q16790 2/20 0.57
NPC1 O15118 3/20 0.55
RAB9A P51151 3/20 0.55
SMN1; SMN2 Q16637 3/20 0.55
HPGD P15428 1/20 0.55
PKM P14618 1/20 0.55
RXFP1 Q9HBX9 1/20 0.55
MEN1 O00255 3/20 0.52
MAPT P10636 3/20 0.52
TDP1 Q9NUW8 1/20 0.52
NPSR1 Q6W5P4 2/20 0.51
TAS1R3 Q7RTX0 1/20 0.51
TAS1R1 Q7RTX1 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3873599 1.00 KDM4E (0.62) KDM4EHSD17B10KMT2AHDAC1HDAC6
SCHEMBL10718021 0.93 KDM4E (0.59) KDM4EHSD17B10KMT2AHDAC1HDAC6
SCHEMBL30296233 0.87 KDM4E (0.59) KDM4EHSD17B10KMT2AHDAC1HDAC6
SCHEMBL9403860 0.87 KDM4E (0.59) KDM4EHSD17B10KMT2AHDAC1HDAC6
SCHEMBL19707984 0.85 KMT2A (0.66) KMT2ACA1CA2CA9NPC1
SCHEMBL9835394 0.83 KMT2A (0.63) KMT2ACA1CA2CA9NPC1
SCHEMBL3883922 0.83 KMT2A (0.63) KMT2ACA1CA2CA9NPC1
SCHEMBL3782005 0.82 KDM4E (0.68) KDM4EHSD17B10KMT2AHDAC1CA1
SCHEMBL21695366 0.82 KMT2A (0.58) KMT2ACA1CA2CA9NPC1
SCHEMBL11435364 0.82 KMT2A (0.58) KMT2ACA1CA2CA9NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118360608-B Copper-reducing additive for IC carrier plate and preparation method and use method thereof 深圳市板明科技股份有限公司 2024-08-13 CN disclosed
CN-118360608-A Copper-reducing additive for IC carrier plate and preparation method and use method thereof 深圳市板明科技股份有限公司 2024-07-19 CN disclosed
CN-109790122-B Heterocyclic compounds 武田药品工业株式会社 2022-06-24 CN disclosed