⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1426674 | 0.80 | — | — | |
| SCHEMBL322426 | 0.72 | — | — | |
| SCHEMBL31186651 | 0.70 | — | — | |
| SCHEMBL31668838 | 0.63 | — | — | |
| SCHEMBL15178398 | 0.62 | CA1 (0.33) | — | |
| SCHEMBL14767651 | 0.62 | TRPA1 (0.30) | — | |
| SCHEMBL10175605 | 0.62 | — | — | |
| SCHEMBL5308708 | 0.62 | — | — | |
| SCHEMBL28108061 | 0.59 | — | — | |
| SCHEMBL12243407 | 0.58 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110483741-B | Tetramethyldiphenol type epoxy resin, epoxy resin composition, cured product, and semiconductor encapsulating material | 三菱化学株式会社 | 2022-07-12 | — | — | CN | disclosed |