SCHEMBL2979236

SCHEMBL2979236

NC(=O)Nc1cccc(-n2nnnc2S)c1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 4/20 0.41
LMNA P02545 4/20 0.41
HTT P42858 1/20 0.41
ALDH1A1 P00352 7/20 0.41
RAB9A P51151 3/20 0.41
CRHBP P24387 1/20 0.41
CRHR2 Q13324 1/20 0.41
MAPT P10636 1/20 0.41
IDO1 P14902 1/20 0.40
TDO2 P48775 1/20 0.40
PKM P14618 2/20 0.40
MAPK1 P28482 1/20 0.40
MEN1 O00255 3/20 0.39
KMT2A Q03164 3/20 0.39
NPC1 O15118 1/20 0.39
KDM4E B2RXH2 1/20 0.39
POLB P06746 1/20 0.39
HPGD P15428 1/20 0.39
PPARG P37231 1/20 0.38
NR2E3 Q9Y5X4 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8172135 0.88 ALDH1A1 (0.43) L3MBTL1LMNAALDH1A1RAB9ACRHBP
SCHEMBL13297727 0.87 ALDH1A1 (0.44) L3MBTL1LMNAHTTALDH1A1RAB9A
SCHEMBL29870318 0.86 IDO1 (0.54) L3MBTL1LMNAALDH1A1RAB9ACRHBP
SCHEMBL1537861 0.86 IDO1 (0.54) L3MBTL1LMNAALDH1A1RAB9ACRHBP
SCHEMBL7954309 0.85 IDO1 (0.53) L3MBTL1LMNAALDH1A1RAB9ACRHBP
SCHEMBL7954313 0.85 IDO1 (0.53) L3MBTL1LMNAALDH1A1RAB9ACRHBP
Bromide SCHEMBL7951258 0.85 IDO1 (0.53) L3MBTL1LMNAALDH1A1RAB9ACRHBP
SCHEMBL14498648 0.85 TSHR (0.46) LMNAHTTRAB9AMAPTMAPK1
SCHEMBL13297731 0.85 ALDH1A1 (0.40) L3MBTL1LMNAALDH1A1RAB9ACRHBP
SCHEMBL1336437 0.84 ALDH1A1 (0.41) L3MBTL1LMNAALDH1A1RAB9ACRHBP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 98 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2071057-B1 ELECTROPLATING COPPER-TIN ALLOY ROHM & HAAS ELECT MAT (US) 2019-01-23 EP claimed
EP-3004429-B1 ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS ROHM & HAAS ELECT MAT (US) 2018-07-18 EP claimed
US-9512529-B2 Electroplating baths of silver and tin alloys ROHM AND HAAS ELECTRONIC MATERIALS LLC 2016-12-06 US claimed
US-7780839-B2 Electroplating bronze ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2010-08-24 US claimed
US-5320938-A Occurs in the presence of iodide EASTMAN KODAK COMPANY (US) 1994-06-14 US claimed
US-12071703-B2 Electroplating solution for indium-bismuth alloy for low-temperature solder with improved bismuth substitution prevention performance HOJIN PLATECH CO., LTD. (KR) 2024-08-27 US disclosed
US-20240167183-A1 ELECTROPLATING SOLUTION FOR INDIUM-BISMUTH ALLOY FOR LOW-TEMPERATURE SOLDER WITH IMPROVED BISMUTH SUBSTITUTION PREVENTION PERFORMANCE HOJIN PLATECH CO., LTD. (KR) 2024-05-23 US disclosed
US-11879181-B2 Electroplating solution of tin or tin alloy with improved thickness variation of wafer bumps HOJIN PLATECH CO., LTD. (KR) 2024-01-23 US disclosed
CN-110176441-B Copper pillars with improved integrity and method of making same 罗门哈斯电子材料有限责任公司 2023-08-01 CN disclosed
US-20230151504-A1 ELECTROPLATING SOLUTION OF TIN OR TIN ALLOY WITH IMPROVED THICKNESS VARIATION OF WAFER BUMPS HOJIN PLATECH CO., LTD. (KR) 2023-05-18 US disclosed
US-10889907-B2 Cyanide-free acidic matte silver electroplating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2021-01-12 US disclosed
US-20200266165-A1 COPPER PILLARS HAVING IMPROVED INTEGRITY AND METHODS OF MAKING THE SAME ROHM & HAAS ELECT MAT (US) 2020-08-20 US disclosed
EP-0665461-A1 Photographic sensitivity increasing alkynylamine compounds and photographic elements EASTMAN KODAK COMPANY (US) 1995-08-02 EP disclosed
US-5413905-A High speed EASTMAN KODAK COMPANY (US) 1995-05-09 US disclosed
US-5399477-A Silver halide photographic elements EASTMAN KODAK COMPANY (US) 1995-03-21 US disclosed
US-5389510-A Increased photosensitivity EASTMAN KODAK COMPANY (US) 1995-02-14 US disclosed
US-5385818-A Process for the preparation of silver halide emulsions and photographic elements containing hollow silver halide grains EASTMAN KODAK COMPANY (US) 1995-01-31 US disclosed
EP-0617320-A2 Tabular grain emulsions containing antifoggants and stabilizers EASTMAN KODAK COMPANY (US) 1994-09-28 EP disclosed
US-5320938-A Occurs in the presence of iodide EASTMAN KODAK COMPANY (US) 1994-06-14 US disclosed
US-4508816-A USING PERSULFATE FUJI PHOTO FILM CO., LTD. (JP) 1985-04-02 US disclosed