⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29105398 | 1.00 | — | — | |
| SCHEMBL245811 | 1.00 | — | — | |
| Hydrochloric Acid SCHEMBL2354589 | 0.97 | — | — | |
| Butadiene SCHEMBL28129793 | 0.89 | ALDH1A1 (0.52) | — | |
| SCHEMBL28244515 | 0.85 | ALOX15 (0.48) | — | |
| SCHEMBL28272736 | 0.80 | — | — | |
| SCHEMBL28100164 | 0.80 | ALOX15 (0.42) | — | |
| SCHEMBL28053343 | 0.80 | ALDH1A1 (0.42) | — | |
| SCHEMBL3134391 | 0.79 | CYP2D6 (1.00) | — | |
| SCHEMBL213024 | 0.79 | CYP2D6 (1.00) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2331649-B1 | METHODS AND COMPOSITIONS FOR POLISHING SILICON-CONTAINING SUBSTRATES | CABOT MICROELECTRONICS CORP (US) | 2018-06-13 | — | — | EP | disclosed |
| US-8597540-B2 | Compositions for polishing silicon-containing substrates | CABOT MICROELECTRONICS CORPORATION (US) | 2013-12-03 | — | — | US | disclosed |
| US-20130200039-A1 | AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS | BASF SE (DE) | 2013-08-08 | — | — | US | disclosed |
| EP-2613910-A1 | PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS | BASF SE (DE) | 2013-07-17 | — | — | EP | disclosed |
| EP-2614122-A1 | AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS | BASF SE (DE) | 2013-07-17 | — | — | EP | disclosed |
| US-8486169-B2 | Method of polishing a silicon-containing dielectric | CABOT MICROELECTRONICS CORPORATION (US) | 2013-07-16 | — | — | US | disclosed |
| US-20130171824-A1 | PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS | BASF SE (DE) | 2013-07-04 | — | — | US | disclosed |
| US-20130168348-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS | BASF SE (DE) | 2013-07-04 | — | — | US | disclosed |
| US-20120280170-A1 | COMPOSITIONS FOR POLISHING SILICON-CONTAINING SUBSTRATES | CABOT MICROELECTRONICS CORPORATION | 2012-11-08 | — | — | US | disclosed |
| US-8247327-B2 | Methods and compositions for polishing silicon-containing substrates | CABOT MICROELECTRONICS CORPORATION (US) | 2012-08-21 | — | — | US | disclosed |
| WO-2010014180-A2 | METHODS AND COMPOSITIONS FOR POLISHING SILICON-CONTAINING SUBSTRATES | CABOT MICROELECTRONICS CORPORATION (US) | 2010-02-04 | — | — | WO | disclosed |
| US-20100029181-A1 | Methods and compositions for polishing silicon-containing substrates | CMC MATERIALS LLC | 2010-02-04 | — | — | US | disclosed |
| US-20090029633-A1 | METHOD OF POLISHING A SILICON-CONTAINING DIELECTRIC | CABOT MICROELECTRONICS CORPORATION (US) | 2009-01-29 | — | — | US | disclosed |
| US-7442645-B2 | Method of polishing a silicon-containing dielectric | CABOT MICROELECTRONICS CORPORATION (US) | 2008-10-28 | — | — | US | disclosed |
| US-20060196848-A1 | Readily deinkable toners | MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT | 2006-09-07 | — | — | US | disclosed |
| US-20060144824-A1 | Method of polishing a silicon-containing dielectric | CABOT MICROELECTRONICS CORPORATION (US) | 2006-07-06 | — | — | US | disclosed |
| US-7071105-B2 | Method of polishing a silicon-containing dielectric | CABOT MICROELECTRONICS CORPORATION (US) | 2006-07-04 | — | — | US | disclosed |
| EP-1601735-A1 | METHOD OF POLISHING A SILICON-CONTAINING DIELECTRIC | Cabot Microelectronics Corporation (US) | 2005-12-07 | — | — | EP | disclosed |
| WO-2004069947-A1 | METHOD OF POLISHING A SILICON-CONTAINING DIELECTRIC | CABOT MICROELECTRONICS CORPORATION (US) | 2004-08-19 | — | — | WO | disclosed |
| US-20040152309-A1 | Method of polishing a silicon-containing dielectric | CABOT MICROELECTRONICS CORPORATION | 2004-08-05 | — | — | US | disclosed |