SCHEMBL29859999

SCHEMBL29859999

CCOCCN1CCC(S)C1=O

nearest known ligand 0.37

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CYP2D6 P10635 1/20 0.37
CYP2C19 P33261 1/20 0.37
FKBP1A P62942 2/20 0.33
RECQL P46063 1/20 0.33
HSD17B10 Q99714 1/20 0.33
PKM P14618 1/20 0.32
NPC1 O15118 1/20 0.32
RAB9A P51151 1/20 0.32
PIK3CD O00329 1/20 0.31
LIPE Q05469 1/20 0.31
ADORA2A P29274 2/20 0.31
ADORA2B P29275 2/20 0.31
PDE4A P27815 1/20 0.31
PDE4B Q07343 1/20 0.31
PDE4C Q08493 1/20 0.31
PDE4D Q08499 1/20 0.31
HRH1 P35367 1/20 0.30
KDM4E B2RXH2 1/20 0.30
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31007027 0.90 RECQL (0.36) CYP2D6CYP2C19FKBP1ARECQLHSD17B10
SCHEMBL5573150 0.84 SMN1; SMN2 (0.36) PKMNPC1RAB9A
SCHEMBL1093304 0.83 MMP1 (0.37) FKBP1AHSD17B10NPC1RAB9APIK3CD
SCHEMBL1092141 0.76
SCHEMBL1092477 0.73 MMP1 (0.40) FKBP1AALDH1A1
SCHEMBL16859438 0.73 ACE (0.36) PIK3CDALDH1A1
SCHEMBL749725 0.72 POLB (0.38) CYP2D6CYP2C19HSD17B10PKMADORA2A
SCHEMBL11162178 0.69 SMN1; SMN2 (0.41) RECQLPKMNPC1RAB9AALDH1A1
SCHEMBL8394448 0.69 CYP1A1 (0.37) KDM4EALDH1A1
SCHEMBL748032 0.68 SCN9A (0.34) CYP2D6CYP2C19HSD17B10PKMADORA2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113848681-B Photosensitive resin composition, dry film and cured film thereof, and printed wiring board using the same 太阳控股株式会社 2024-09-03 CN disclosed
WO-2022211082-A1 PHOTOSENSITIVE FILM LAMINATED BODY, CURED PRODUCT, AND PRINTED CIRCUIT BOARD 太陽インキ製造株式会社 2022-10-06 WO disclosed