SCHEMBL2992458

SCHEMBL2992458

[CH]1[CH][CH]C[CH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4130638 0.94
SCHEMBL6862011 0.69
SCHEMBL975744 0.67
SCHEMBL7697307 0.59
SCHEMBL23908715 0.56
SCHEMBL7694325 0.56
SCHEMBL25653 0.54
SCHEMBL3788025 0.50
SCHEMBL2088 0.47
SCHEMBL2326 0.47

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527101-B Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component 信越化学工业株式会社 2024-04-23 CN disclosed
EP-3896114-B1 POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-18 EP disclosed
US-11572442-B2 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2023-02-07 US disclosed
US-11261303-B2 Polyimide resin film and method for producing polyimide resin film MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-03-01 US disclosed
CN-113527101-A Novel compound, polymer and method for producing same, photosensitive resin composition, method for forming pattern, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896114-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317270-A1 NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed
EP-3489284-B1 POLYIMIDE RESIN FILM AND METHOD FOR PRODUCING POLYIMIDE RESIN FILM MITSUBISHI GAS CHEMICAL CO (JP) 2021-06-09 EP disclosed
US-20190185631-A1 POLYIMIDE RESIN FILM AND METHOD FOR PRODUCING POLYIMIDE RESIN FILM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2019-06-20 US disclosed
EP-3489284-A1 POLYIMIDE RESIN FILM AND METHOD FOR PRODUCING POLYIMIDE RESIN FILM Mitsubishi Gas Chemical Company, Inc. (JP) 2019-05-29 EP disclosed
US-20140117280-A1 OXYGEN ABSORBER MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-05-01 US disclosed
EP-2711077-A1 OXYGEN ABSORBER Mitsubishi Gas Chemical Company, Inc. (JP) 2014-03-26 EP disclosed
US-8357322-B2 Process and apparatus for production of colorless transparent resin film MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2013-01-22 US disclosed
EP-2147766-B1 PROCESS AND APPARATUS FOR PRODUCTION OF COLORLESS TRANSPARENT RESIN FILM MITSUBISHI GAS CHEMICAL CO (JP) 2012-08-01 EP disclosed
US-20100187719-A1 PROCESS AND APPARATUS FOR PRODUCTION OF COLORLESS TRANSPARENT RESIN FILM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2010-07-29 US disclosed
EP-2147766-A1 PROCESS AND APPARATUS FOR PRODUCTION OF COLORLESS TRANSPARENT RESIN FILM Mitsubishi Gas Chemical Company, Inc. (JP) 2010-01-27 EP disclosed
US-6335143-B1 Resist composition containing specific cross-linking agent WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) 2002-01-01 US disclosed
EP-0887706-A1 Resist composition containing specific cross-linking agent WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) 1998-12-30 EP disclosed