⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3788025 | 0.78 | — | — | |
| SCHEMBL7689983 | 0.76 | — | — | |
| SCHEMBL7695201 | 0.74 | — | — | |
| SCHEMBL2992458 | 0.67 | — | — | |
| SCHEMBL976278 | 0.65 | — | — | |
| SCHEMBL9866494 | 0.65 | — | — | |
| SCHEMBL4130638 | 0.63 | — | — | |
| SCHEMBL452093 | 0.61 | — | — | |
| SCHEMBL2088 | 0.57 | — | — | |
| SCHEMBL974724 | 0.55 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8460576-B2 | Liquid crystal composition containing polymerizable compound and liquid crystal display element using the same | DIC CORPORATION (JP) | 2013-06-11 | — | — | US | claimed |
| US-8425800-B2 | Liquid crystal composition containing polymerizable compound and liquid crystal display element using the same | DIC CORPORATION (JP) | 2013-04-23 | — | — | US | claimed |
| US-20110253936-A1 | LIQUID CRYSTAL COMPOSITION CONTAINING POLYMERIZABLE COMPOUND AND LIQUID CRYSTAL DISPLAY ELEMENT USING THE SAME | DIC CORPORATION (JP) | 2011-10-20 | — | — | US | claimed |
| US-20110253933-A1 | LIQUID CRYSTAL COMPOSITION CONTAINING POLYMERIZABLE COMPOUND AND LIQUID CRYSTAL DISPLAY ELEMENT USING THE SAME | DIC CORPORATION (JP) | 2011-10-20 | — | — | US | claimed |
| CN-113527101-B | Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component | 信越化学工业株式会社 | 2024-04-23 | — | — | CN | disclosed |
| EP-3896114-B1 | POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-18 | — | — | EP | disclosed |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2023-02-07 | — | — | US | disclosed |
| CN-113527101-A | Novel compound, polymer and method for producing same, photosensitive resin composition, method for forming pattern, cured film, and electronic component | 信越化学工业株式会社 | 2021-10-22 | — | — | CN | disclosed |
| EP-3896114-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| US-20210317270-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| US-9597306-B1 | Fumarate compounds, pharmaceutical compositions thereof, and methods of use | Nguyen, Mark Quang (US) | 2017-03-21 | — | — | US | disclosed |
| US-20170056358-A1 | FUMARATE COMPOUNDS, PHARMACEUTICAL COMPOSITIONS THEREOF, AND METHODS OF USE | Nguyen, Mark Quang (US) | 2017-03-02 | — | — | US | disclosed |
| EP-2262861-B1 | SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE | DOW CORNING (US) | 2012-09-19 | — | — | EP | disclosed |
| US-20110253936-A1 | LIQUID CRYSTAL COMPOSITION CONTAINING POLYMERIZABLE COMPOUND AND LIQUID CRYSTAL DISPLAY ELEMENT USING THE SAME | DIC CORPORATION (JP) | 2011-10-20 | — | — | US | disclosed |
| US-20110253933-A1 | LIQUID CRYSTAL COMPOSITION CONTAINING POLYMERIZABLE COMPOUND AND LIQUID CRYSTAL DISPLAY ELEMENT USING THE SAME | DIC CORPORATION (JP) | 2011-10-20 | — | — | US | disclosed |
| US-20110017986-A1 | Silicone Composition and Organic Light-Emitting Diode | DOW CORNING CORPORATION | 2011-01-27 | — | — | US | disclosed |
| EP-2262861-A1 | SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE | Dow Corning Corporation (US) | 2010-12-22 | — | — | EP | disclosed |
| WO-2009120434-A1 | SILICONE COMPOSITION AND ORGANIC LIGHT-EMITTING DIODE | DOW CORNING CORPORATION (US) | 2009-10-01 | — | — | WO | disclosed |
| US-6335143-B1 | Resist composition containing specific cross-linking agent | WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) | 2002-01-01 | — | — | US | disclosed |
| EP-0887706-A1 | Resist composition containing specific cross-linking agent | WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) | 1998-12-30 | — | — | EP | disclosed |