SCHEMBL29963389

SCHEMBL29963389

CC(C)(C)c1ccc2c(OC(=O)C3CCCCC3C(=O)O)c3ccccc3cc2c1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 2/20 0.40
▸ ALDH1A1 P00352 3/20 0.39
▸ SLC6A2 P23975 1/20 0.37
▸ EPHX1 P07099 1/20 0.35
▸ HSD17B10 Q99714 2/20 0.35
▸ CYP1A2 P05177 1/20 0.35
▸ CYP2D6 P10635 1/20 0.35
▸ CYP2C19 P33261 1/20 0.35
▸ TSHR P16473 1/20 0.34
▸ RECQL P46063 1/20 0.34
▸ MAPK14 Q16539 1/20 0.34
▸ CYP2C9 P11712 1/20 0.33
▸ FPR1 P21462 1/20 0.33
▸ CRHBP P24387 1/20 0.33
▸ CRHR2 Q13324 1/20 0.33
▸ SMN1; SMN2 Q16637 1/20 0.33
▸ NPSR1 Q6W5P4 1/20 0.33
▸ LMNA P02545 3/20 0.33
▸ GPR84 Q9NQS5 1/20 0.33
▸ MEN1 O00255 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28894515 1.00 KDM4E (0.40) KDM4EALDH1A1SLC6A2EPHX1HSD17B10
SCHEMBL28894628 0.94 KDM4E (0.40) KDM4EALDH1A1SLC6A2EPHX1HSD17B10
SCHEMBL29963356 0.92 SLC6A2 (0.38) KDM4EALDH1A1SLC6A2EPHX1CYP2C19
SCHEMBL29963187 0.89 SLC6A2 (0.40) KDM4EALDH1A1SLC6A2HSD17B10CYP1A2
SCHEMBL29963893 0.89 SLC6A2 (0.40) KDM4EALDH1A1SLC6A2HSD17B10CYP1A2
SCHEMBL28894490 0.87 KDM4E (0.49) KDM4EALDH1A1EPHX1HSD17B10CYP1A2
SCHEMBL29963396 0.87 KDM4E (0.49) KDM4EALDH1A1EPHX1HSD17B10CYP1A2
SCHEMBL28894353 0.87 KMT2A (0.41) KDM4EALDH1A1HSD17B10TSHRRECQL
SCHEMBL29962997 0.87 KMT2A (0.41) KDM4EALDH1A1HSD17B10TSHRRECQL
SCHEMBL29963246 0.85 KDM4E (0.42) KDM4EALDH1A1EPHX1HSD17B10TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380075-B Epoxy resin composition for sealing semiconductor 纳美仕有限公司 2024-06-18 — — CN disclosed
CN-115380075-A Epoxy resin composition for semiconductor encapsulation 纳美仕有限公司 2022-11-22 — — CN disclosed
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