SCHEMBL28894353

SCHEMBL28894353

CC(C)(C)c1ccc2c(OC(=O)C3CC=CCC3C(=O)O)c3ccccc3cc2c1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KMT2A Q03164 5/20 0.41
▸ TDP1 Q9NUW8 4/20 0.41
▸ ALDH1A1 P00352 4/20 0.41
▸ MEN1 O00255 3/20 0.41
▸ SMN1; SMN2 Q16637 2/20 0.41
▸ HTT P42858 2/20 0.41
▸ BLM P54132 1/20 0.41
▸ HSD17B10 Q99714 3/20 0.35
▸ TSHR P16473 2/20 0.35
▸ POLB P06746 4/20 0.34
▸ KDM4E B2RXH2 3/20 0.34
▸ MAPK14 Q16539 1/20 0.34
▸ GAA P10253 2/20 0.33
▸ HPGD P15428 3/20 0.33
▸ GPR84 Q9NQS5 1/20 0.33
▸ APEX1 P27695 1/20 0.32
▸ MAPT P10636 3/20 0.32
▸ L3MBTL1 Q9Y468 1/20 0.32
▸ NR1I2 O75469 1/20 0.32
▸ TAAR1 Q96RJ0 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29962997 1.00 KMT2A (0.41) KMT2ATDP1ALDH1A1MEN1SMN1; SMN2
SCHEMBL28894518 0.94 ALDH1A1 (0.43) KMT2ATDP1ALDH1A1MEN1SMN1; SMN2
SCHEMBL28895039 0.92 ALDH1A1 (0.44) KMT2ATDP1ALDH1A1MEN1SMN1; SMN2
SCHEMBL28894981 0.89 ALDH1A1 (0.46) KMT2ATDP1ALDH1A1MEN1SMN1; SMN2
SCHEMBL30945733 0.89 ALDH1A1 (0.46) KMT2ATDP1ALDH1A1MEN1SMN1; SMN2
SCHEMBL28894624 0.87 HSD17B10 (0.43) KMT2ATDP1ALDH1A1MEN1SMN1; SMN2
SCHEMBL28894515 0.87 KDM4E (0.40) KMT2AALDH1A1MEN1SMN1; SMN2HSD17B10
SCHEMBL29963389 0.87 KDM4E (0.40) KMT2AALDH1A1MEN1SMN1; SMN2HSD17B10
SCHEMBL28894988 0.87 POLB (0.34) KMT2ATDP1ALDH1A1MEN1SMN1; SMN2
SCHEMBL29963286 0.87 POLB (0.34) KMT2ATDP1ALDH1A1MEN1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380075-B Epoxy resin composition for sealing semiconductor 纳美仕有限公司 2024-06-18 — — CN disclosed
CN-115380075-A Epoxy resin composition for semiconductor encapsulation 纳美仕有限公司 2022-11-22 — — CN disclosed
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