Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 2/20 | 0.50 |
| ▸ | CA2 | P00918 | 2/20 | 0.50 |
| ▸ | HTT | P42858 | 1/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.45 |
| ▸ | TSHR | P16473 | 3/20 | 0.45 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.45 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.45 |
| ▸ | HPGD | P15428 | 2/20 | 0.45 |
| ▸ | CYP1A1 | P04798 | 1/20 | 0.45 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.45 |
| ▸ | CYP1B1 | Q16678 | 1/20 | 0.45 |
| ▸ | MAP2K1 | Q02750 | 1/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.40 |
| ▸ | MCL1 | Q07820 | 2/20 | 0.38 |
| ▸ | GAA | P10253 | 2/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.38 |
| ▸ | ATM | Q13315 | 1/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL819594 | 1.00 | CA1 (0.50) | CA1CA2HTTALDH1A1TSHR | |
| Hydrogen Sulfide SCHEMBL29288364 | 0.97 | CA1 (0.48) | CA1CA2HTTALDH1A1TSHR | |
| SCHEMBL10338061 | 0.92 | TSHR (0.50) | CA1CA2HTTALDH1A1TSHR | |
| Pyrene SCHEMBL4592363 | 0.84 | ALDH1A1 (0.55) | CA1CA2HTTALDH1A1TSHR | |
| SCHEMBL31174981 | 0.84 | DYRK1A (0.43) | CA1CA2HTTALDH1A1TSHR | |
| SCHEMBL17950524 | 0.84 | DYRK1A (0.44) | CA1CA2HTTALDH1A1TSHR | |
| SCHEMBL26714940 | 0.84 | TSHR (0.58) | CA1CA2HTTALDH1A1TSHR | |
| SCHEMBL4081102 | 0.84 | MAP2K1 (0.46) | CA1CA2HTTALDH1A1TSHR | |
| SCHEMBL17955163 | 0.84 | DYRK1A (0.43) | CA1CA2HTTALDH1A1TSHR | |
| SCHEMBL4960170 | 0.84 | ALDH1A1 (0.45) | CA1CA2HTTALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118574903-A | High performance thermosetting resins for 3D printing | 诺佳3D创新有限公司 | 2024-08-30 | — | — | CN | claimed |
| WO-2025054709-A1 | CYCLIC IMIDE-DIOXIME VANADIUM COMPLEXES AND USES THEREOF | UTI LIMITED PARTNERSHIP (CA) | 2025-03-20 | — | — | WO | disclosed |
| CN-116457417-B | Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2025-02-14 | — | — | CN | disclosed |
| CN-119013353-A | Resin composition, prepreg, resin sheet, laminated sheet, metal foil-clad laminated sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-11-22 | — | — | CN | disclosed |
| CN-118922502-A | Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-11-08 | — | — | CN | disclosed |
| CN-117795003-B | Curable composition, prepreg, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-10-25 | — | — | CN | disclosed |
| CN-118679206-A | Method for producing curable resin | 三菱瓦斯化学株式会社 | 2024-09-20 | — | — | CN | disclosed |
| CN-118574903-A | High performance thermosetting resins for 3D printing | 诺佳3D创新有限公司 | 2024-08-30 | — | — | CN | disclosed |
| CN-114845874-B | Resin sheet and printed circuit board | 三菱瓦斯化学株式会社 | 2024-08-23 | — | — | CN | disclosed |
| CN-114196204-B | Prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2024-07-16 | — | — | CN | disclosed |
| CN-118251457-A | Thermosetting resin composition, prepreg and printed wiring board | 三菱瓦斯化学株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-117836369-A | Curable composition, prepreg, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-117836370-A | Curable composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-117836359-A | Prepreg, metal foil-clad laminate, and printed circuit board | 三菱瓦斯化学株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-117795016-A | Resin composition, resin sheet, prepreg, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-03-29 | — | — | CN | disclosed |
| CN-117795003-A | Curable composition, prepreg, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-03-29 | — | — | CN | disclosed |
| CN-116457417-A | Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2023-07-18 | — | — | CN | disclosed |
| CN-112601662-B | Laminate, metal foil-clad laminate, patterned laminate with metal foil, laminate having laminate structure, printed circuit board, multilayer coreless substrate, and method for producing same | 三菱瓦斯化学株式会社 | 2023-07-07 | — | — | CN | disclosed |
| CN-115516008-A | Method for producing dispersion, paste, and kneaded powder | ＡＧＣ株式会社 | 2022-12-23 | — | — | CN | disclosed |
| CN-114845874-A | Resin sheet and printed wiring board | 三菱瓦斯化学株式会社 | 2022-08-02 | — | — | CN | disclosed |