SCHEMBL30002212

SCHEMBL30002212

CNC1(NC)C=CC(C(=O)O)=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29281092 0.80
SCHEMBL29066545 0.79 KDM4E (0.36)
SCHEMBL29190482 0.76 CYP3A4 (0.39)
SCHEMBL27447537 0.74
SCHEMBL14153908 0.73
SCHEMBL16034931 0.73 CCR2 (0.30)
SCHEMBL7895545 0.73
SCHEMBL7707622 0.73
SCHEMBL8381192 0.72
SCHEMBL28068398 0.72 GRM4 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12098238-B2 Curable resin, curable resin composition, cured product, electronic device, laminated board material, electronic component encapsulant, and method for producing curable resin CENTRAL GLASS COMPANY, LIMITED (JP) 2024-09-24 US disclosed
EP-4089131-B1 CURABLE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC DEVICE, LAMINATED BOARD MATERIAL, ELECTRONIC COMPONENT ENCAPSULANT, AND METHOD FOR PRODUCING CURABLE RESIN CENTRAL GLASS CO LTD (JP) 2024-06-26 EP disclosed
US-20230097638-A1 Curable Resin, Curable Resin Composition, Cured Product, Electronic Device, Laminated Board Material, Electronic Component Encapsulant, and Method for Producing Curable Resin CENTRAL GLASS COMPANY, LIMITED (JP) 2023-03-30 US disclosed
EP-4089131-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC DEVICE, LAMINATED BOARD MATERIAL, ELECTRONIC COMPONENT ENCAPSULANT, AND METHOD FOR PRODUCING CURABLE RESIN Central Glass Company, Limited (JP) 2022-11-16 EP disclosed