SCHEMBL3000562

SCHEMBL3000562

[CH]1[CH][CH][CH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6640735 1.00
SCHEMBL6559802 0.58
SCHEMBL25472 0.58
SCHEMBL29889134 0.58
Hydrochloric Acid SCHEMBL72335 0.41
Water SCHEMBL490048 0.41
SCHEMBL74539 0.41
SCHEMBL1179177 0.41
Fluoride Ion SCHEMBL73611 0.41
SCHEMBL1629906 0.41

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-11335461-A None JP disclosed
JP-11181090-A None JP disclosed
US-20240199847-A1 RESIN COMPOSITION AND ELECTRONIC DEVICE KONICA MINOLTA INC (JP) 2024-06-20 US disclosed
US-11920019-B2 Resin composition and electronic device Konica Minolta, Inc. (JP) 2024-03-05 US disclosed
EP-3896114-B1 POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-18 EP disclosed
US-11572442-B2 Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2023-02-07 US disclosed
CN-112805337-B Resin composition and electronic device 柯尼卡美能达株式会社 2022-10-28 CN disclosed
US-11261303-B2 Polyimide resin film and method for producing polyimide resin film MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-03-01 US disclosed
US-20210347964-A1 RESIN COMPOSITION AND ELECTRONIC DEVICE Konica Minolta, Inc. (JP) 2021-11-11 US disclosed
CN-108884245-B Polyimide film and method for producing same 柯尼卡美能达株式会社 2021-10-29 CN disclosed
US-8357322-B2 Process and apparatus for production of colorless transparent resin film MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2013-01-22 US disclosed
EP-2147766-B1 PROCESS AND APPARATUS FOR PRODUCTION OF COLORLESS TRANSPARENT RESIN FILM MITSUBISHI GAS CHEMICAL CO (JP) 2012-08-01 EP disclosed
US-20100187719-A1 PROCESS AND APPARATUS FOR PRODUCTION OF COLORLESS TRANSPARENT RESIN FILM MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2010-07-29 US disclosed
EP-2147766-A1 PROCESS AND APPARATUS FOR PRODUCTION OF COLORLESS TRANSPARENT RESIN FILM Mitsubishi Gas Chemical Company, Inc. (JP) 2010-01-27 EP disclosed
US-6335143-B1 Resist composition containing specific cross-linking agent WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) 2002-01-01 US disclosed
JP-H11335461-A LIQUID CRYSTAL ORIENTING AGENT SUMITOMO BAKELITE CO LTD 1999-12-07 JP disclosed
EP-0946552-A1 SULFONAMIDES AND DERIVATIVES THEREOF THAT MODULATE THE ACTIVITY OF ENDOTHELIN TEXAS BIOTECHNOLOGY CORPORATION (US) 1999-10-06 EP disclosed
JP-H11181090-A POLYIMDE PRECURSOR COMPOSITION AND LIQUID CRYSTAL ORIENTING AGENT SUMITOMO BAKELITE CO LTD 1999-07-06 JP disclosed
EP-0887706-A1 Resist composition containing specific cross-linking agent WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) 1998-12-30 EP disclosed
WO-1998013366-A1 SULFONAMIDES AND DERIVATIVES THEREOF THAT MODULATE THE ACTIVITY OF ENDOTHELIN TEXAS BIOTECHNOLOGY CORPORATION (US) 1998-04-02 WO disclosed