SCHEMBL30009756

SCHEMBL30009756

CCC(C)(O)C(=O)O.COC(=O)C(C)(C)O

nearest known ligand 0.40

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.40
TSHR P16473 1/20 0.40
TET2 Q6N021 1/20 0.36
DGAT1 O75907 1/20 0.34
SRC P12931 1/20 0.32
KCNN4 O15554 1/20 0.31
POLB P06746 1/20 0.30
HMGCR P04035 1/20 0.30
CHRM1 P11229 1/20 0.30
TBXA2R P21731 1/20 0.30
ADRA1A P35348 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30874323 0.85 PKM (0.34) ALDH1A1TSHR
SCHEMBL79613 0.82
SCHEMBL4963143 0.82 TSHR (0.50) ALDH1A1TSHRTET2HMGCRCHRM1
SCHEMBL2327762 0.82
SCHEMBL581582 0.82
SCHEMBL29242724 0.82 ALDH1A1 (0.39) ALDH1A1TSHRTET2POLB
SCHEMBL28869957 0.80
SCHEMBL3827004 0.80
SCHEMBL1063211 0.80
SCHEMBL6755733 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119535888-A Photoresist solution and preparation method of patterned photoresist layer 台湾积体电路制造股份有限公司 2025-02-28 CN disclosed
CN-117795049-A Composition for removing edge bead from metal-containing resist and method for forming pattern 三星SDI株式会社 2024-03-29 CN disclosed
CN-117616109-A Composition for removing edge bead from metal-containing resist and method for forming pattern 三星SDI株式会社 2024-02-27 CN disclosed
WO-2023032753-A1 LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2023-03-09 WO disclosed
CN-115220303-A Photosensitive resin composition and display device comprising same 株式会社东进世美肯 2022-10-21 CN disclosed