Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 3/20 | 0.48 |
| ▸ | TP53 | P04637 | 1/20 | 0.48 |
| ▸ | CASP1 | P29466 | 1/20 | 0.41 |
| ▸ | RECQL | P46063 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.37 |
| ▸ | CA12 | O43570 | 1/20 | 0.34 |
| ▸ | CA1 | P00915 | 1/20 | 0.34 |
| ▸ | CA2 | P00918 | 1/20 | 0.34 |
| ▸ | CA7 | P43166 | 1/20 | 0.34 |
| ▸ | CA9 | Q16790 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.34 |
| ▸ | MAOB | P27338 | 4/20 | 0.34 |
| ▸ | MAOA | P21397 | 3/20 | 0.34 |
| ▸ | ADRA2C | P18825 | 1/20 | 0.34 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL434177 | 1.00 | CYP3A4 (0.48) | CYP3A4TP53CASP1RECQLALDH1A1 | |
| SCHEMBL574271 | 0.86 | TP53 (0.33) | CYP3A4TP53ALDH1A1 | |
| SCHEMBL8954070 | 0.85 | TSHR (0.44) | CYP3A4TP53CASP1RECQLALDH1A1 | |
| SCHEMBL4453580 | 0.83 | CYP3A4 (0.47) | CYP3A4TP53CASP1RECQLALDH1A1 | |
| SCHEMBL8953997 | 0.83 | CYP3A4 (0.47) | CYP3A4TP53CASP1RECQLALDH1A1 | |
| SCHEMBL3468837 | 0.83 | TP53 (0.36) | CYP3A4TP53SMN1; SMN2 | |
| SCHEMBL21409813 | 0.82 | TSHR (0.49) | CYP3A4TP53CASP1RECQLALDH1A1 | |
| SCHEMBL5024549 | 0.80 | CYP3A4 (0.44) | CYP3A4TP53CASP1RECQLALDH1A1 | |
| SCHEMBL5023574 | 0.80 | CYP3A4 (0.44) | CYP3A4TP53CASP1RECQLALDH1A1 | |
| SCHEMBL21409757 | 0.80 | TSHR (0.40) | CYP3A4TP53CASP1RECQLALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115268215-B | Photosensitive polyimide resin composition, photosensitive polyimide film containing photosensitive polyimide resin composition and application of photosensitive polyimide film | 吉林奥来德光电材料股份有限公司 | 2025-05-16 | — | — | CN | claimed |
| CN-119781246-A | Photosensitive polyimide resin composition, cured film, and preparation method and application thereof | 吉林奥来德光电材料股份有限公司 | 2025-04-08 | — | — | CN | claimed |
| CN-115268215-A | Photosensitive polyimide resin composition, photosensitive polyimide film containing same and application of photosensitive polyimide resin composition | 吉林奥来德光电材料股份有限公司 | 2022-11-01 | — | — | CN | claimed |
| CN-115268215-B | Photosensitive polyimide resin composition, photosensitive polyimide film containing photosensitive polyimide resin composition and application of photosensitive polyimide film | 吉林奥来德光电材料股份有限公司 | 2025-05-16 | — | — | CN | disclosed |
| CN-119781246-A | Photosensitive polyimide resin composition, cured film, and preparation method and application thereof | 吉林奥来德光电材料股份有限公司 | 2025-04-08 | — | — | CN | disclosed |
| CN-116643458-A | Diamine compound, photosensitive polyimide resin composition, and preparation method and application thereof | 吉林奥来德光电材料股份有限公司 | 2023-08-25 | — | — | CN | disclosed |
| CN-115246930-B | Novel polyimide resin, photosensitive polyimide resin composition, and preparation methods and applications thereof | 吉林奥来德光电材料股份有限公司 | 2023-08-18 | — | — | CN | disclosed |
| CN-115268215-A | Photosensitive polyimide resin composition, photosensitive polyimide film containing same and application of photosensitive polyimide resin composition | 吉林奥来德光电材料股份有限公司 | 2022-11-01 | — | — | CN | disclosed |
| CN-115246930-A | Novel polyimide resin, photosensitive polyimide resin composition, and preparation method and application thereof | 吉林奥来德光电材料股份有限公司 | 2022-10-28 | — | — | CN | disclosed |