Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 4/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 10/20 | 0.42 |
| ▸ | LMNA | P02545 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.42 |
| ▸ | HPGD | P15428 | 3/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.42 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.42 |
| ▸ | APOBEC3G | Q9HC16 | 2/20 | 0.42 |
| ▸ | MAPT | P10636 | 1/20 | 0.42 |
| ▸ | HAVCR2 | Q8TDQ0 | 1/20 | 0.42 |
| ▸ | USP2 | O75604 | 1/20 | 0.40 |
| ▸ | RECQL | P46063 | 2/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.39 |
| ▸ | UPP1 | Q16831 | 1/20 | 0.39 |
| ▸ | SHBG | P04278 | 1/20 | 0.39 |
| ▸ | ESR1 | P03372 | 1/20 | 0.38 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.38 |
| ▸ | GAA | P10253 | 1/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL24854679 | 0.83 | KDM4E (0.43) | MEN1KMT2AKDM4ELMNAALDH1A1 | |
| SCHEMBL15599249 | 0.83 | KDM4E (0.46) | MEN1KMT2AKDM4ELMNAALDH1A1 | |
| SCHEMBL28650262 | 0.81 | KDM4E (0.42) | MEN1KMT2AKDM4ELMNAALDH1A1 | |
| SCHEMBL28248982 | 0.81 | KDM4E (0.40) | MEN1KMT2AKDM4ELMNAALDH1A1 | |
| SCHEMBL25786462 | 0.81 | KDM4E (0.40) | MEN1KMT2AKDM4ELMNAALDH1A1 | |
| SCHEMBL5524083 | 0.81 | KDM4E (0.40) | MEN1KMT2AKDM4ELMNAALDH1A1 | |
| SCHEMBL27878369 | 0.79 | KDM4E (0.44) | MEN1KMT2AKDM4ELMNAALDH1A1 | |
| SCHEMBL25695809 | 0.78 | KDM4E (0.42) | MEN1KMT2AKDM4ELMNAALDH1A1 | |
| SCHEMBL28865511 | 0.78 | KDM4E (0.40) | MEN1KMT2AKDM4ELMNAALDH1A1 | |
| SCHEMBL1344362 | 0.76 | KDM4E (0.46) | MEN1KMT2AKDM4ELMNAALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2020132858-A1 | RESIN COMPOSITION, PREPREG USED FOR PRINTED CIRCUIT, AND METAL-CLAD LAMINATE | 广东生益科技股份有限公司 | 2020-07-02 | — | — | WO | claimed |
| EP-0594644-B1 | ANISOTROPIC CONDUCTIVE ADHESIVE FILM | MINNESOTA MINING & MFG (US) | 1997-03-12 | — | — | EP | claimed |
| EP-0357006-B1 | Structures exhibitting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials which allow their construction | CYTEC TECH CORP (US) | 1994-02-09 | — | — | EP | claimed |
| CN-115698131-B | Curable thermoset compositions comprising poly (arylene ether) copolymers | 高新特殊工程塑料全球技术有限公司 | 2025-06-17 | — | — | CN | disclosed |
| CN-113796169-B | Method for manufacturing printed circuit board and printed circuit board | 三菱瓦斯化学株式会社 | 2025-05-27 | — | — | CN | disclosed |
| CN-118786161-A | Copolymers derived from dicyclopentadiene | 高新特殊工程塑料全球技术有限公司 | 2024-10-15 | — | — | CN | disclosed |
| CN-114650979-B | Compound, mixture, curable resin composition, cured product thereof, and method for producing compound | 日本化药株式会社 | 2024-09-17 | — | — | CN | disclosed |
| CN-114845874-B | Resin sheet and printed circuit board | 三菱瓦斯化学株式会社 | 2024-08-23 | — | — | CN | disclosed |
| CN-118475639-A | Capped poly (phenylene ether) s and curable thermoset compositions containing the same | 高新特殊工程塑料全球技术有限公司 | 2024-08-09 | — | — | CN | disclosed |
| CN-114196204-B | Prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2024-07-16 | — | — | CN | disclosed |
| CN-118251440-A | Copolymers derived from dicyclopentadiene | 高新特殊工程塑料全球技术有限公司 | 2024-06-25 | — | — | CN | disclosed |
| CN-110662795-A | Prepreg, method for producing same, laminate, printed wiring board, and semiconductor package | 日立化成株式会社 | 2020-01-07 | — | — | CN | disclosed |
| US-20140341242-A1 | RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-11-20 | — | — | US | disclosed |
| US-20140183715-A1 | SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2014-07-03 | — | — | US | disclosed |
| US-20100197368-A1 | CABLE HARNESS BODY | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2010-08-05 | — | — | US | disclosed |
| EP-1875555-A1 | CABLE HARNESS BODY | 3M Innovative Properties Company (US) | 2008-01-09 | — | — | EP | disclosed |
| WO-2006110363-A1 | CABLE HARNESS BODY | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2006-10-19 | — | — | WO | disclosed |
| EP-0594644-B1 | ANISOTROPIC CONDUCTIVE ADHESIVE FILM | MINNESOTA MINING & MFG (US) | 1997-03-12 | — | — | EP | disclosed |
| EP-0594644-A1 | ANISOTROPIC CONDUCTIVE ADHESIVE FILM. | MINNESOTA MINING & MFG (US) | 1994-05-04 | — | — | EP | disclosed |
| WO-1993001248-A1 | ANISOTROPIC CONDUCTIVE ADHESIVE FILM | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1993-01-21 | — | — | WO | disclosed |