SCHEMBL30102587

SCHEMBL30102587

CC(C)c1ccc(N)cc1C(C)C

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ANPEP P15144 1/20 0.41
ALDH1A1 P00352 4/20 0.40
CYP3A4 P08684 5/20 0.39
CASP1 P29466 3/20 0.39
HSD17B10 Q99714 1/20 0.39
LMNA P02545 2/20 0.38
SLC6A2 P23975 2/20 0.38
HTR2B P41595 2/20 0.38
TRPA1 O75762 1/20 0.38
CHRM1 P11229 1/20 0.38
ADRA1A P35348 1/20 0.38
GAA P10253 1/20 0.36
TSHR P16473 3/20 0.36
PDE10A Q9Y233 1/20 0.36
MEN1 O00255 2/20 0.35
MAPT P10636 2/20 0.35
KMT2A Q03164 2/20 0.35
NPC1 O15118 1/20 0.35
POLB P06746 1/20 0.35
RAB9A P51151 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2379856 1.00 ANPEP (0.41) ANPEPALDH1A1CYP3A4CASP1HSD17B10
SCHEMBL29368425 0.82 CASP1 (0.48) ANPEPALDH1A1CYP3A4CASP1HSD17B10
SCHEMBL49477 0.82 CASP1 (0.48) ANPEPALDH1A1CYP3A4CASP1HSD17B10
SCHEMBL28252731 0.82 CASP1 (0.42) ANPEPALDH1A1CYP3A4CASP1HSD17B10
SCHEMBL33893 0.82 CASP1 (0.42) ANPEPALDH1A1CYP3A4CASP1HSD17B10
SCHEMBL5486247 0.82 CASP1 (0.48) ANPEPALDH1A1CYP3A4CASP1HSD17B10
SCHEMBL29433029 0.82 CASP1 (0.42) ANPEPALDH1A1CYP3A4CASP1HSD17B10
SCHEMBL2154295 0.82 ANPEP (0.47) ANPEPALDH1A1CYP3A4CASP1HSD17B10
SCHEMBL12446714 0.81 ALDH1A1 (0.48) ANPEPALDH1A1CYP3A4HSD17B10MEN1
SCHEMBL3435087 0.80 ALDH1A1 (0.54) ANPEPALDH1A1CYP3A4CASP1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120092029-A Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board 三菱瓦斯化学株式会社 2025-06-03 CN disclosed
CN-119899377-A Polymaleimide compound, curable composition, cured product, prepreg, circuit board, laminate film, semiconductor sealing material, and semiconductor device DIC株式会社 2025-04-29 CN disclosed
CN-116891635-A Curable composition, cured product, prepreg, circuit board, laminated film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-116891633-A Curable composition, cured product, prepreg, circuit board, laminate film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-116891634-A Curable composition, cured product, prepreg, circuit board, laminated film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-116891632-A Curable composition, cured product, prepreg, circuit board, laminate film, semiconductor sealing material, and semiconductor device DIC株式会社 2023-10-17 CN disclosed
CN-115558104-A Polymaleimide compound, curable composition, cured product, prepreg, circuit board, and build-up film DIC株式会社 2023-01-03 CN disclosed