SCHEMBL3010609

SCHEMBL3010609

C=C[Si](C=C)(C=C)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28910834 0.69
SCHEMBL335955 0.67
SCHEMBL335979 0.65
SCHEMBL307665 0.65
SCHEMBL15854758 0.65
SCHEMBL7106959 0.65
SCHEMBL2898091 0.65
SCHEMBL2208465 0.65
SCHEMBL30607222 0.65
SCHEMBL15224272 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115298282-A Silicone composition for release sheet and release sheet 信越化学工业株式会社 2022-11-04 CN disclosed
CN-107573693-B Liquid silicone resin foam material and preparation method thereof 中国工程物理研究院化工材料研究所 2021-06-22 CN disclosed
EP-3323867-B1 SILICONE COMPOSITION FOR RELEASE PAPER OR RELEASE FILM, AND RELEASE PAPER AND RELEASE FILM SHINETSU CHEMICAL CO (JP) 2021-03-03 EP disclosed
CN-111937216-A Additive for nonaqueous electrolyte solution, and electricity storage device 住友精化株式会社 2020-11-13 CN disclosed
CN-110615992-A Chopped fiber reinforced organic silicon resin composition and preparation method thereof 中国工程物理研究院化工材料研究所 2019-12-27 CN disclosed
US-20190002746-A1 SILICONE COMPOSITION FOR RELEASE PAPER OR RELEASE FILM, AND RELEASE PAPER AND RELEASE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-01-03 US disclosed
EP-3323867-A1 SILICONE COMPOSITION FOR RELEASE PAPER OR RELEASE FILM, AND RELEASE PAPER AND RELEASE FILM Shin-Etsu Chemical Co., Ltd. (JP) 2018-05-23 EP disclosed
US-9851668-B2 Fixing member, fixing device, and image forming apparatus FUJI XEROX CO., LTD. (JP) 2017-12-26 US disclosed
US-20170261893-A1 FIXING MEMBER, FIXING DEVICE, AND IMAGE FORMING APPARATUS FUJI XEROX CO., LTD. (JP) 2017-09-14 US disclosed
US-20130299140-A1 Insulated thermal interface material NATIONAL TSING HUA UNIVERSITY (TW) 2013-11-14 US disclosed
US-20090043067-A1 PROCESS FOR PRODUCING LENS, AND LENS FUJIFILM CORPORATION (JP) 2009-02-12 US disclosed
US-20060264583-A1 Lens-forming silicone resin composition and silicone lens SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-11-23 US disclosed
US-20060264567-A1 Lens-forming silicone resin composition and silicone lens SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-11-23 US disclosed
US-6709715-B1 DEPOSITING DIELECTRIC LAYER; USING SUCH AS TETRAVINYL-TETRAMETHYLCYCLOTETRASILOXANE, TETRAALLYLOXYSILANE OR TRIVINYLMETHYLSILANE APPLIED MATERIALS INC. 2004-03-23 US disclosed
US-6362115-B1 DISSOCIATING 1,4-BIS(FORMATOMETHYL)BENZENE OR 1,4-BIS(N-METHYLAMINOMETHYL) BENZENE, CONDENSING P-XYLYLENE TO FORM A POLYMERIZED THIN POLYMER OR COPOLYMER LAYER; LOW DIELECTRIC CONSTANTS; SEMICONDUCTORS APPLIED MATERIALS, INC. 2002-03-26 US disclosed
EP-0915120-B1 Method for termination of post cure in silicone elastomers DOW CORNING (US) 2002-01-30 EP disclosed
US-6133396-A NON-PYROPHORIC POLYMETHYLSILANE COMPRISING DEHALOCOUPLED DICHLOROMETHYLSILANE THE REGENTS OF THE UNIVERSITY OF MICHIGAN (US) 2000-10-17 US disclosed
US-5929164-A THICKENING SOLVENTS BY REACTING A HYDRIDOPOLYSILOXANE, A ALPHA-OMEGA DIENE USING A PLATINUM HYDROSILATION CATALYST AND SOLVENT; GELATION; REACTING WITH AN UNSATURATED SILANE AND SHEARING TO FORM A PASTE DOW CORNING CORPORATION (US) 1999-07-27 US disclosed
EP-0915120-A2 Method for termination of post cure in silicone elastomers DOW CORNING CORPORATION (US) 1999-05-12 EP disclosed
US-3974122-A Heat-curable silicone resin compositions SHIN-ETSU CHEMICAL CO., LTD. (JA) 1976-08-10 US disclosed